Kensuke Nagaoka

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer processing method including attaching a protective tape to a...
- Patent number 9,779,993
- Issue date Oct 3, 2017
- Disco Corporation
- Yuki Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 9,716,039
- Issue date Jul 25, 2017
- Disco Corporation
- Yuki Ogawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer processing method
- Patent number 9,536,787
- Issue date Jan 3, 2017
- Disco Corporation
- Yuki Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 9,293,372
- Issue date Mar 22, 2016
- Disco Corporation
- Kensuke Nagaoka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20160343614
- Publication date Nov 24, 2016
- Disco Corporation
- Yuki Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20160315011
- Publication date Oct 27, 2016
- Disco Corporation
- Yuki Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20160111331
- Publication date Apr 21, 2016
- Disco Corporation
- Yuki Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20160027696
- Publication date Jan 28, 2016
- Disco Corporation
- Kensuke Nagaoka
- H01 - BASIC ELECTRIC ELEMENTS