Kent Kime

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a molded array package device having an exposed t...
- Patent number 7,901,990
- Issue date Mar 8, 2011
- Semiconductor Components Industries, LLC
- James P. Letterman, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having enhanced thermal dissipation...
- Patent number 7,755,179
- Issue date Jul 13, 2010
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a molded array package device having an exposed t...
- Patent number 7,602,054
- Issue date Oct 13, 2009
- Semiconductor Components Industries, LLC
- James P. Letterman, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device formed having a metal layer for conducting the...
- Patent number 6,984,876
- Issue date Jan 10, 2006
- Semiconductor Components Industries, LLC
- Kent Kime
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of manufacture
- Patent number 6,147,410
- Issue date Nov 14, 2000
- Motorola, Inc.
- Alexander J. Elliott
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A MOLDED ARRAY PACKAGE DEVICE HAVING AN EXPOSED T...
- Publication number 20100019367
- Publication date Jan 28, 2010
- James P. Letterman, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Structure Having Enhanced Thermal Dissipation...
- Publication number 20080246130
- Publication date Oct 9, 2008
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a molded array package device having an exposed t...
- Publication number 20070075409
- Publication date Apr 5, 2007
- Semiconductor Components Industries, LLC.
- James P. Letterman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FORMED HAVING A METAL LAYER FOR CONDUCTING THE...
- Publication number 20050263859
- Publication date Dec 1, 2005
- Semiconductor Components Industries, LLC.
- Kent Kime
- H01 - BASIC ELECTRIC ELEMENTS