Kent W. Hansen

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming a microelectronic assembly
- Patent number 5,848,466
- Issue date Dec 15, 1998
- Motorola, Inc.
- Daniel Joseph Viza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide with an electrically conductive channel
- Patent number 5,555,341
- Issue date Sep 10, 1996
- Motorola, Inc.
- Ravinder K. Sharma
- G02 - OPTICS
Information Patent Grant
Optoelectronic interface module
- Patent number 5,550,941
- Issue date Aug 27, 1996
- Motorola
- Michael S. Lebby
- G02 - OPTICS
Information Patent Grant
Method of making an optoelectronic interface module
- Patent number 5,482,658
- Issue date Jan 9, 1996
- Motorola, Inc.
- Michael S. Lebby
- G02 - OPTICS
Information Patent Grant
Monocrystalline semiconductor buried layers for electrical contacts...
- Patent number 4,849,371
- Issue date Jul 18, 1989
- Motorola Inc.
- Kent W. Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive pressure sensor and method of making it
- Patent number 4,184,189
- Issue date Jan 15, 1980
- Motorola, Inc.
- Earl K. Davis
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Sealing glass compositions and method
- Patent number 4,131,478
- Issue date Dec 26, 1978
- Motorola, Inc.
- Earl K. Davis
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Solder glass composition and method of using same for encapsulating...
- Patent number 3,964,920
- Issue date Jun 22, 1976
- Motorola, Inc.
- Earl K. Davis
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Kent W. Hansen

Person

Patents Grantslast 30 patents

Method for forming a microelectronic assembly

Waveguide with an electrically conductive channel

Optoelectronic interface module

Method of making an optoelectronic interface module

Monocrystalline semiconductor buried layers for electrical contacts...

Capacitive pressure sensor and method of making it

Sealing glass compositions and method

Solder glass composition and method of using same for encapsulating...