Kent Yang

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package mold flow control system and method
- Patent number 12,062,625
- Issue date Aug 13, 2024
- SanDisk Technologies, Inc.
- Hope Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having thermally conductive pathways
- Patent number 11,508,644
- Issue date Nov 22, 2022
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Package Having Improved Conductive Stub Coverage
- Publication number 20230129628
- Publication date Apr 27, 2023
- Western Digital Technologies, Inc.
- Simon Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Mold Flow Control System and Method
- Publication number 20230102959
- Publication date Mar 30, 2023
- Western Digital Technologies, Inc.
- Hope Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMALLY CONDUCTIVE PATHWAYS
- Publication number 20220216128
- Publication date Jul 7, 2022
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS