TREA

Kenta Chito

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Processing method of wafer
    • Patent number 11,456,213
    • Issue date Sep 27, 2022
    • Disco Corporation
    • Yoshiteru Nishida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of processing a wafer
    • Patent number 10,957,593
    • Issue date Mar 23, 2021
    • Disco Corporation
    • Yoshiteru Nishida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Hold checking method and unhold checking method for wafer
    • Patent number 10,910,246
    • Issue date Feb 2, 2021
    • Disco Corporation
    • Kenta Chito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electrostatic chuck
    • Patent number 10,896,836
    • Issue date Jan 19, 2021
    • Disco Corporation
    • Kenta Chito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 10,790,192
    • Issue date Sep 29, 2020
    • Disco Corporation
    • Yoshiteru Nishida
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 10,790,193
    • Issue date Sep 29, 2020
    • Disco Corporation
    • Yoshiteru Nishida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer unloading method
    • Patent number 10,665,492
    • Issue date May 26, 2020
    • Disco Corporation
    • Kenta Chito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Plasma etching method
    • Patent number 10,453,719
    • Issue date Oct 22, 2019
    • Disco Corporation
    • Kenta Chito
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    PROCESSING METHOD OF WAFER
    • Publication number 20210082763
    • Publication date Mar 18, 2021
    • Disco Corporation
    • Yoshiteru NISHIDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING A WAFER
    • Publication number 20200176313
    • Publication date Jun 4, 2020
    • Disco Corporation
    • Yoshiteru NISHIDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20190311951
    • Publication date Oct 10, 2019
    • Disco Corporation
    • Yoshiteru NISHIDA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20190311952
    • Publication date Oct 10, 2019
    • Disco Corporation
    • Yoshiteru NISHIDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTROSTATIC CHUCK
    • Publication number 20190019712
    • Publication date Jan 17, 2019
    • Disco Corporation
    • Kenta Chito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER UNLOADING METHOD
    • Publication number 20180301363
    • Publication date Oct 18, 2018
    • Disco Corporation
    • Kenta Chito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLASMA ETCHING METHOD
    • Publication number 20180240690
    • Publication date Aug 23, 2018
    • Disco Corporation
    • Kenta Chito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HOLD CHECKING METHOD AND UNHOLD CHECKING METHOD FOR WAFER
    • Publication number 20180025928
    • Publication date Jan 25, 2018
    • Disco Corporation
    • Kenta Chito
    • H01 - BASIC ELECTRIC ELEMENTS