Kenta Matsunaga

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for removing tiebars after molding of semiconductor chip
- Patent number 6,925,922
- Issue date Aug 9, 2005
- Renesas Technology Corp.
- Hidekazu Manabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for removing tiebars after molding of semiconductor chip
- Publication number 20050230789
- Publication date Oct 20, 2005
- Renesas Technology Corp.
- Hidekazu Manabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for removing tiebars after molding of semiconductor chip
- Publication number 20030079734
- Publication date May 1, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Hidekazu Manabe
- H01 - BASIC ELECTRIC ELEMENTS