Kenta Ogawa

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
External storage device and method of manufacturing external storag...
- Patent number 9,666,659
- Issue date May 30, 2017
- Renesas Electronics Corporation
- Yasutaka Nakashiba
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 9,362,263
- Issue date Jun 7, 2016
- Renesas Electronics Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of manufacturing the same
- Patent number RE45987
- Issue date Apr 26, 2016
- RENESAS ELECTRONICS COPORATION
- Kenta Ogawa
- 001 -
Information Patent Grant
Semiconductor device
- Patent number 9,165,879
- Issue date Oct 20, 2015
- Renesas Electronics Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a recess formed above a semiconducto...
- Patent number 8,810,021
- Issue date Aug 19, 2014
- Renesas Electronics Corporation
- Yasutaka Nakashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,772,914
- Issue date Jul 8, 2014
- Renesas Electronics Corporation
- Yasutaka Nakashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 8,753,922
- Issue date Jun 17, 2014
- Renesas Electronics Corporation
- Yasutaka Nakashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
External storage device and method of manufacturing external storag...
- Patent number 8,705,238
- Issue date Apr 22, 2014
- Renesas Electronics Corporation
- Yasutaka Nakashiba
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing a wiring board
- Patent number 8,389,414
- Issue date Mar 5, 2013
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device that performs signal transmission using induct...
- Patent number 8,378,470
- Issue date Feb 19, 2013
- Renesas Electronics Corporation
- Yasutaka Nakashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component having an authentication pattern
- Patent number 8,357,935
- Issue date Jan 22, 2013
- Renesas Electronics Corporation
- Yasuhiro Matsumaru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and communication method
- Patent number 8,283,770
- Issue date Oct 9, 2012
- Renesas Electronics Corporation
- Yasutaka Nakashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and communication method
- Patent number 7,982,303
- Issue date Jul 19, 2011
- Renesas Electronics Corporation
- Yasutaka Nakashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device using wiring board and their man...
- Patent number 7,911,038
- Issue date Mar 22, 2011
- Renesas Electronics Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, method for manufacturing same, and semiconductor package
- Patent number 7,838,779
- Issue date Nov 23, 2010
- NEC Corporation
- Shintaro Yamamichi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnecting substrate and semiconductor device
- Patent number 7,745,736
- Issue date Jun 29, 2010
- NEC Electronics Corporation
- Kenta Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wiring substrate and semiconductor device
- Patent number 7,701,726
- Issue date Apr 20, 2010
- NEC Electronics Corporation
- Jun Tsukano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 7,674,989
- Issue date Mar 9, 2010
- NEC Electronics Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, semiconductor device, and method of manufacturing...
- Patent number 7,649,749
- Issue date Jan 19, 2010
- NEC Electronics Corporation
- Jun Tsukano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having external terminals with lead-free metal th...
- Patent number 7,235,309
- Issue date Jun 26, 2007
- NEC Electronics Corporation
- Kenta Ogawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and method of manufacturing the same
- Patent number 6,884,523
- Issue date Apr 26, 2005
- NEC Electronics Corporation
- Kenta Ogawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160005727
- Publication date Jan 7, 2016
- RENESAS ELECTRONICS CORPORATION
- Shintaro YAMAMACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140361411
- Publication date Dec 11, 2014
- RENESAS ELECTRONICS CORPORATION
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTERNAL STORAGE DEVICE AND METHOD OF MANUFACTURING EXTERNAL STORAG...
- Publication number 20140191363
- Publication date Jul 10, 2014
- RENESAS ELECTRONICS CORPORATION
- Yasutaka Nakashiba
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130127033
- Publication date May 23, 2013
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20130130442
- Publication date May 23, 2013
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20130122662
- Publication date May 16, 2013
- Renesas Electronics Corporation
- Yasuhiro Matsumaru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND COMMUNICATION METHOD
- Publication number 20130043558
- Publication date Feb 21, 2013
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and method of manufacturing electronic component
- Publication number 20120043648
- Publication date Feb 23, 2012
- RENESAS ELECTRONICS CORPORATION
- Yasuhiro MATSUMARU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Authentication device, authentication method, and an information st...
- Publication number 20120045114
- Publication date Feb 23, 2012
- RENESAS ELECTRONICS CORPORATION
- Yasuhiro Matsumaru
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor device and communication method
- Publication number 20110241165
- Publication date Oct 6, 2011
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND COMMUNICATION METHOD
- Publication number 20110143662
- Publication date Jun 16, 2011
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
External storage device and method of manufacturing external storag...
- Publication number 20110141681
- Publication date Jun 16, 2011
- RENESAS ELECTRONICS CORPORATION
- Yasutaka Nakashiba
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF MANUFACTURING A WIRING BOARD
- Publication number 20110136298
- Publication date Jun 9, 2011
- NEC Corporation
- Katsumi KIKUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20110049693
- Publication date Mar 3, 2011
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100258955
- Publication date Oct 14, 2010
- NEC ELECTRONICS CORPORATION
- YUICHI MIYAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD COMPOSITE BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR M...
- Publication number 20100232127
- Publication date Sep 16, 2010
- NEC ELECTRONICS CORPORATION
- Kentaro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENTS HAVING BUMP
- Publication number 20100044416
- Publication date Feb 25, 2010
- NEC Corporation
- Kenta OGAWA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE USING WIRING BOARD AND THEIR MAN...
- Publication number 20090315190
- Publication date Dec 24, 2009
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20090137085
- Publication date May 28, 2009
- NEC Electronics Corporation
- Jun Tsukano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate, semiconductor device, and method of manufacturing...
- Publication number 20080012140
- Publication date Jan 17, 2008
- NEC Electronics Corporation
- Jun Tsukano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device with lead-free metal thin film formed on the surf...
- Publication number 20070243405
- Publication date Oct 18, 2007
- NEC Electronics Corporation
- KENTA OGAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board and method for manufacturing the same
- Publication number 20060283629
- Publication date Dec 21, 2006
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, method for manufacturing same, and semiconductor package
- Publication number 20060283625
- Publication date Dec 21, 2006
- NEC Corporation
- Shintaro Yamamichi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnecting substrate and semiconductor device
- Publication number 20060192287
- Publication date Aug 31, 2006
- Kenta Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20050056446
- Publication date Mar 17, 2005
- NEC ELECTRONICS CORPORATION
- Kenta Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device having external terminals with lead-free metal th...
- Publication number 20040126268
- Publication date Jul 1, 2004
- NEC ELECTRONICS CORPORATION
- Kenta Ogawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20030193094
- Publication date Oct 16, 2003
- NEC Electronics Corporation
- Nobuaki Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component and method of manufacturing same
- Publication number 20030156395
- Publication date Aug 21, 2003
- NEC Electronics Corporation
- Kenta Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kenta Ogawa

Person

Patents Grantslast 30 patents

External storage device and method of manufacturing external storag...

Semiconductor device

Electronic component and method of manufacturing the same

Semiconductor device

Semiconductor device including a recess formed above a semiconducto...

Semiconductor device

Method of manufacturing a semiconductor device

External storage device and method of manufacturing external storag...

Method of manufacturing a wiring board

Semiconductor device that performs signal transmission using induct...

Electronic component having an authentication pattern

Semiconductor device and communication method

Semiconductor device and communication method

Wiring board, semiconductor device using wiring board and their man...

Wiring board, method for manufacturing same, and semiconductor package

Interconnecting substrate and semiconductor device

Method of manufacturing a wiring substrate and semiconductor device

Wiring board and method for manufacturing the same

Wiring substrate, semiconductor device, and method of manufacturing...

Electronic device having external terminals with lead-free metal th...

Electronic component and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

EXTERNAL STORAGE DEVICE AND METHOD OF MANUFACTURING EXTERNAL STORAG...

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE AND COMMUNICATION METHOD

Electronic component and method of manufacturing electronic component

Authentication device, authentication method, and an information st...

Semiconductor device and communication method

SEMICONDUCTOR DEVICE AND COMMUNICATION METHOD

External storage device and method of manufacturing external storag...

METHOD OF MANUFACTURING A WIRING BOARD

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD COMPOSITE BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR M...

METHOD OF MANUFACTURING ELECTRONIC COMPONENTS HAVING BUMP

WIRING BOARD, SEMICONDUCTOR DEVICE USING WIRING BOARD AND THEIR MAN...

METHOD OF MANUFACTURING A WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

Wiring substrate, semiconductor device, and method of manufacturing...

Electronic device with lead-free metal thin film formed on the surf...

Wiring board and method for manufacturing the same

Wiring board, method for manufacturing same, and semiconductor package

Interconnecting substrate and semiconductor device

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

Electronic device having external terminals with lead-free metal th...

Semiconductor device and method for fabricating the same

Electronic component and method of manufacturing same