Kenta Tsujie

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Titanium copper foil, extended copper article, electronic device co...
- Patent number 12,000,029
- Issue date Jun 4, 2024
- JX Metals Corporation
- Kenta Tsujie
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Titanium copper foil, extended copper article, electronic device co...
- Patent number 11,739,397
- Issue date Aug 29, 2023
- JX Nippon Mining & Metals Corporation
- Kenta Tsujie
- C21 - METALLURGY OF IRON
Information Patent Grant
High strength titanium copper strip and foil having layered structure
- Patent number 11,180,829
- Issue date Nov 23, 2021
- JX Nippon Mining & Metals Corporation
- Kenta Tsujie
- G02 - OPTICS
Information Patent Grant
High strength titanium copper strip and foil having layered structure
- Patent number 11,174,534
- Issue date Nov 16, 2021
- JX Nippon Mining & Metals Corporation
- Kenta Tsujie
- G02 - OPTICS
Information Patent Grant
Titanium copper foil having plated layer
- Patent number 10,908,381
- Issue date Feb 2, 2021
- JX Nippon Mining & Metals Corporation
- Kenta Tsujie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-titanium alloy foil having plated layer
- Patent number 10,495,840
- Issue date Dec 3, 2019
- JX Nippon Mining & Metals Corporation
- Kenta Tsujie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Titanium-copper alloy having plating layer
- Patent number 10,092,970
- Issue date Oct 9, 2018
- JX Nippon Mining & Metals Corporation
- Kenta Tsujie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
TITANIUM COPPER FOIL, EXTENDED COPPER ARTICLE, ELECTRONIC DEVICE CO...
- Publication number 20220002841
- Publication date Jan 6, 2022
- JX NIPPON MINING & METALS CORPORATION
- Kenta Tsujie
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
TITANIUM COPPER FOIL, EXTENDED COPPER ARTICLE, ELECTRONIC DEVICE CO...
- Publication number 20210371957
- Publication date Dec 2, 2021
- JX NIPPON MINING & METALS CORPORATION
- Kenta Tsujie
- C21 - METALLURGY OF IRON
Information Patent Application
High Strength Titanium Copper Strip and Foil Having Layered Structure
- Publication number 20210108288
- Publication date Apr 15, 2021
- JX NIPPON MINING & METALS CORPORATION
- Kenta Tsujie
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
High Strength Titanium Copper Strip and Foil Having Layered Structure
- Publication number 20200024698
- Publication date Jan 23, 2020
- JX NIPPON MINING & METALS CORPORATION
- Kenta Tsujie
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Titanium Copper Foil Having Plated Layer
- Publication number 20170285294
- Publication date Oct 5, 2017
- JX NIPPON MINING & METALS CORPORATION
- Kenta Tsujie
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper-titanium Alloy Foil Having Plated Layer
- Publication number 20170285295
- Publication date Oct 5, 2017
- JX NIPPON MINING & METALS CORPORATION
- Kenta Tsujie
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Titanium-Copper Alloy Having Plating Layer
- Publication number 20160199929
- Publication date Jul 14, 2016
- JX NIPPON MINING & METALS CORPORATION
- Kenta Tsujie
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Kenta Tsujie

Person

Patents Grantslast 30 patents

Titanium copper foil, extended copper article, electronic device co...

Titanium copper foil, extended copper article, electronic device co...

High strength titanium copper strip and foil having layered structure

High strength titanium copper strip and foil having layered structure

Titanium copper foil having plated layer

Copper-titanium alloy foil having plated layer

Titanium-copper alloy having plating layer

Patents Applicationslast 30 patents

TITANIUM COPPER FOIL, EXTENDED COPPER ARTICLE, ELECTRONIC DEVICE CO...

TITANIUM COPPER FOIL, EXTENDED COPPER ARTICLE, ELECTRONIC DEVICE CO...

High Strength Titanium Copper Strip and Foil Having Layered Structure

High Strength Titanium Copper Strip and Foil Having Layered Structure

Titanium Copper Foil Having Plated Layer

Copper-titanium Alloy Foil Having Plated Layer

Titanium-Copper Alloy Having Plating Layer