Kenta UCHIYAMA

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic apparatus having a resin filled through electrode config...
- Patent number 9,515,050
- Issue date Dec 6, 2016
- Shinko Electric Industries Co., Ltd.
- Kenta Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the semiconducto...
- Patent number 9,136,220
- Issue date Sep 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kenta Uchiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for manufacturing the semiconducto...
- Patent number 9,099,478
- Issue date Aug 4, 2015
- Shinko Electric Industries Co., Ltd.
- Kenta Uchiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for manufacturing the semiconducto...
- Patent number 9,041,211
- Issue date May 26, 2015
- Shinko Electric Industries Co., Ltd.
- Kenta Uchiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked chips package having feed-through electrode connecting the...
- Patent number 8,786,103
- Issue date Jul 22, 2014
- Shinko Electric Industries Co., Ltd.
- Kenta Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric part package and manufacturing method thereof
- Patent number 8,692,363
- Issue date Apr 8, 2014
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same, and an...
- Patent number 8,450,853
- Issue date May 28, 2013
- Shinko Electric Industries Co., Ltd.
- Kenta Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board with lead pins and method of producing the same
- Patent number 8,314,347
- Issue date Nov 20, 2012
- Shinko Electric Industries Co., Ltd.
- Kenta Uchiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method of manufacturing same
- Patent number 8,174,109
- Issue date May 8, 2012
- Shinko Electric Industries Co., Ltd.
- Kenta Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method thereof, and electronic...
- Patent number 8,169,072
- Issue date May 1, 2012
- Shinko Electric Industries Co., Ltd.
- Kenta Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC APPARATUS AND FABRICATION METHOD OF THE SAME
- Publication number 20140291865
- Publication date Oct 2, 2014
- Shinko Electric Industries Co., Ltd.
- Kenta UCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTO...
- Publication number 20130069245
- Publication date Mar 21, 2013
- Shinko Electric Industries Co., Ltd.
- Kenta UCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTO...
- Publication number 20130069219
- Publication date Mar 21, 2013
- Shinko Electric Industries Co., Ltd.
- Kenta UCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20120119391
- Publication date May 17, 2012
- Shinko Electric Industries Co., Ltd.
- Naoyuki KOIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC PART PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20120119379
- Publication date May 17, 2012
- Shinko Electric Industries Co., Ltd.
- Naoyuki KOIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND FABRICATION METHOD OF THE SAME
- Publication number 20100258944
- Publication date Oct 14, 2010
- Shinko Electric Industries Co., Ltd.
- Kenta Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20100258946
- Publication date Oct 14, 2010
- Shinko Electric Industries Co., Ltd.
- Kenta Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20100252937
- Publication date Oct 7, 2010
- Shinko Electric Industries Co., Ltd.
- Kenta UCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME, AND AN...
- Publication number 20100213616
- Publication date Aug 26, 2010
- Shinko Electric Industries Co., Ltd.
- Kenta UCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH LEAD PINS AND METHOD OF PRODUCING THE SAME
- Publication number 20100147561
- Publication date Jun 17, 2010
- Shinko Electric Industries Co., Ltd.
- Kenta Uchiyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Kenta UCHIYAMA

Person

Patents Grantslast 30 patents

Electronic apparatus having a resin filled through electrode config...

Semiconductor package and method for manufacturing the semiconducto...

Semiconductor package and method for manufacturing the semiconducto...

Semiconductor package and method for manufacturing the semiconducto...

Stacked chips package having feed-through electrode connecting the...

Electric part package and manufacturing method thereof

Semiconductor device and a method of manufacturing the same, and an...

Wiring board with lead pins and method of producing the same

Electronic device and method of manufacturing same

Semiconductor device, manufacturing method thereof, and electronic...

Patents Applicationslast 30 patents

ELECTRONIC APPARATUS AND FABRICATION METHOD OF THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTO...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTO...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRIC PART PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC APPARATUS AND FABRICATION METHOD OF THE SAME

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME, AND AN...

WIRING BOARD WITH LEAD PINS AND METHOD OF PRODUCING THE SAME