TREA

Kentaro Iizuka

Follow

Person

  • Tokyo, JP
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Carrier tray
    • Patent number 11,521,877
    • Issue date Dec 6, 2022
    • Disco Corporation
    • Kentaro Iizuka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Workpiece processing method
    • Patent number 11,355,359
    • Issue date Jun 7, 2022
    • Disco Corporation
    • Kentaro Iizuka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer producing apparatus
    • Patent number 10,981,250
    • Issue date Apr 20, 2021
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing apparatus
    • Patent number 10,916,460
    • Issue date Feb 9, 2021
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing apparatus and carrying tray
    • Patent number 10,910,241
    • Issue date Feb 2, 2021
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing apparatus
    • Patent number 10,840,116
    • Issue date Nov 17, 2020
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing apparatus
    • Patent number 10,799,987
    • Issue date Oct 13, 2020
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Chuck table
    • Patent number 9,381,577
    • Issue date Jul 5, 2016
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Separating apparatus
    • Patent number 9,266,315
    • Issue date Feb 23, 2016
    • Disco Corporation
    • Kentaro Iizuka
    • B32 - LAYERED PRODUCTS
  • Information Patent Grant

    Wafer processing method including forming blocking and dividing gro...
    • Patent number 7,863,160
    • Issue date Jan 4, 2011
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method for applying resin film to face of semiconductor wafer
    • Patent number 7,799,700
    • Issue date Sep 21, 2010
    • Disco Corporation
    • Kentaro Iizuka
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Wafer processing method
    • Patent number 7,772,092
    • Issue date Aug 10, 2010
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Chuck table for use in a laser beam processing machine
    • Patent number 7,649,157
    • Issue date Jan 19, 2010
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Apparatus for dividing an adhesive film mounted on a wafer
    • Patent number 7,602,071
    • Issue date Oct 13, 2009
    • Disco Corporation
    • Naoki Ohmiya
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer dividing method
    • Patent number 7,329,564
    • Issue date Feb 12, 2008
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    HOLDING TABLE ASSEMBLY AND PROCESSING METHOD
    • Publication number 20230201977
    • Publication date Jun 29, 2023
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MARKING MACHINE AND WAFER PRODUCTION SYSTEM
    • Publication number 20220410320
    • Publication date Dec 29, 2022
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20220250192
    • Publication date Aug 11, 2022
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CARRIER TRAY
    • Publication number 20210265186
    • Publication date Aug 26, 2021
    • Disco Corporation
    • Kentaro IIZUKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WORKPIECE PROCESSING METHOD
    • Publication number 20210193482
    • Publication date Jun 24, 2021
    • Disco Corporation
    • Kentaro IIZUKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PRODUCING APPARATUS
    • Publication number 20200130106
    • Publication date Apr 30, 2020
    • Disco Corporation
    • Kentaro IIZUKA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING APPARATUS AND CARRYING TRAY
    • Publication number 20190181024
    • Publication date Jun 13, 2019
    • Disco Corporation
    • Kentaro IIZUKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PRODUCING APPARATUS
    • Publication number 20190006212
    • Publication date Jan 3, 2019
    • Disco Corporation
    • Kentaro Iizuka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PRODUCING APPARATUS
    • Publication number 20180354067
    • Publication date Dec 13, 2018
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20180214976
    • Publication date Aug 2, 2018
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEPARATING APPARATUS
    • Publication number 20140196855
    • Publication date Jul 17, 2014
    • Disco Corporation
    • Kentaro Iizuka
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    CHUCK TABLE
    • Publication number 20140091537
    • Publication date Apr 3, 2014
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer processing method
    • Publication number 20090191693
    • Publication date Jul 30, 2009
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer processing method
    • Publication number 20090191692
    • Publication date Jul 30, 2009
    • DISCO CORPORATION
    • Kentaro IIzuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method for applying resin film to face of semiconductor wafer
    • Publication number 20070054498
    • Publication date Mar 8, 2007
    • DISCO CORPORATION
    • Kentaro Iizuka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Tape expansion apparatus
    • Publication number 20060180136
    • Publication date Aug 17, 2006
    • DISCO CORPORATION
    • Yusuke Nagai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wafer dividing method
    • Publication number 20060084239
    • Publication date Apr 20, 2006
    • DISCO CORPORATION
    • Yusuke Nagai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method and apparatus for dividing an adhesive film mounted on a wafer
    • Publication number 20060030129
    • Publication date Feb 9, 2006
    • DISCO CORPORATION
    • Naoki Ohmiya
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Chuck table for use in a laser beam processing machine
    • Publication number 20050205531
    • Publication date Sep 22, 2005
    • DISCO CORPORATION
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Laser beam processing machine
    • Publication number 20050205540
    • Publication date Sep 22, 2005
    • DISCO CORPORATION
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR