Kentaro Kumazawa

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ink jet device
- Patent number 11,279,133
- Issue date Mar 22, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidehiro Yoshida
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Ink jet printing method printing a test substrate and a printing ta...
- Patent number 10,369,783
- Issue date Aug 6, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kentaro Kumazawa
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Semiconductor device, flip-chip mounting method and flip-chip mount...
- Patent number 8,895,359
- Issue date Nov 25, 2014
- Panasonic Corporation
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing mounting structure and mounting structure
- Patent number 8,436,253
- Issue date May 7, 2013
- Panasonic Corporation
- Takayuki Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device mounted structure and its manufacturing method...
- Patent number 8,426,965
- Issue date Apr 23, 2013
- Panasonic Corporation
- Teppei Iwase
- B30 - PRESSES
Information Patent Grant
Semiconductor device having stable signal transmission at high spee...
- Patent number 8,415,794
- Issue date Apr 9, 2013
- Panasonic Corporation
- Kentaro Kumazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing structure for electronic component and resin sealing...
- Patent number 8,358,018
- Issue date Jan 22, 2013
- Panasonic Corporation
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device mounted structure and its manufacturing method...
- Patent number 8,264,079
- Issue date Sep 11, 2012
- Panasonic Corporation
- Teppei Iwase
- B30 - PRESSES
Information Patent Grant
Flip-chip mounting method, flip-chip mounting apparatus and tool pr...
- Patent number 8,163,599
- Issue date Apr 24, 2012
- Panasonic Corporation
- Yoshihiro Tomura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Mounting structure and mounting method
- Patent number 8,080,884
- Issue date Dec 20, 2011
- Panasonic Corporation
- Kojiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,050,049
- Issue date Nov 1, 2011
- Panasonic Corporation
- Teppei Iwase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip assembly and fabrication method therefor
- Patent number 8,035,225
- Issue date Oct 11, 2011
- Panasonic Corporation
- Kojiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor device
- Patent number 7,994,638
- Issue date Aug 9, 2011
- Panasonic Corporation
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode junction structure and manufacturing method thereof
- Patent number 7,985,078
- Issue date Jul 26, 2011
- Panasonic Corporation
- Kentaro Kumazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit device and method for manufacturing same
- Patent number 7,910,406
- Issue date Mar 22, 2011
- Panasonic Corporation
- Kentaro Kumazawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COATING HEAD
- Publication number 20230311509
- Publication date Oct 5, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- KENTARO KUMAZAWA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
INK JET DEVICE
- Publication number 20210094293
- Publication date Apr 1, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Hidehiro YOSHIDA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
INK-JET PRINTING METHOD
- Publication number 20180222180
- Publication date Aug 9, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- KENTARO KUMAZAWA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD...
- Publication number 20120298310
- Publication date Nov 29, 2012
- Teppei Iwase
- B30 - PRESSES
Information Patent Application
SEMICONDUCTOR DEVICE, FLIP-CHIP MOUNTING METHOD AND FLIP-CHIP MOUNT...
- Publication number 20110175237
- Publication date Jul 21, 2011
- PANASONIC CORPORATION
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MOUNTING STRUCTURE AND MOUNTING STRUCTURE
- Publication number 20110061913
- Publication date Mar 17, 2011
- PANASONIC CORPORATION
- Takayuki Higuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20110042808
- Publication date Feb 24, 2011
- Kentaro Kumazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP MOUNTING METHOD, FLIP-CHIP MOUNTING APPARATUS AND TOOL PR...
- Publication number 20110020983
- Publication date Jan 27, 2011
- PANASONIC CORPORATION
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100265683
- Publication date Oct 21, 2010
- Panasonic Corporation
- Teppei IWASE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD...
- Publication number 20100181667
- Publication date Jul 22, 2010
- Teppei Iwase
- B30 - PRESSES
Information Patent Application
ELECTRODE JUNCTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20100167597
- Publication date Jul 1, 2010
- Kentaro KUMAZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20100032832
- Publication date Feb 11, 2010
- PANASONIC CORPORATION
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND MOUNTING METHOD
- Publication number 20090321926
- Publication date Dec 31, 2009
- Panasonic Corporation
- Kojiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND RESIN PACKAGING METHOD FOR ELECTRONIC COMP...
- Publication number 20090278265
- Publication date Nov 12, 2009
- Panasonic Corporation
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20090267214
- Publication date Oct 29, 2009
- Kentaro Kumazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Assembly And Fabrication Method Therefor
- Publication number 20080150133
- Publication date Jun 26, 2008
- Matsushita Electric Industrial Co., Ltd.
- Kojiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

Kentaro Kumazawa

Person

Patents Grantslast 30 patents

Ink jet device

Ink jet printing method printing a test substrate and a printing ta...

Semiconductor device, flip-chip mounting method and flip-chip mount...

Method of manufacturing mounting structure and mounting structure

Semiconductor device mounted structure and its manufacturing method...

Semiconductor device having stable signal transmission at high spee...

Resin sealing structure for electronic component and resin sealing...

Semiconductor device mounted structure and its manufacturing method...

Flip-chip mounting method, flip-chip mounting apparatus and tool pr...

Mounting structure and mounting method

Semiconductor device

Semiconductor chip assembly and fabrication method therefor

Semiconductor chip and semiconductor device

Electrode junction structure and manufacturing method thereof

Electronic circuit device and method for manufacturing same

Patents Applicationslast 30 patents

COATING HEAD

INK JET DEVICE

INK-JET PRINTING METHOD

SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD...

SEMICONDUCTOR DEVICE, FLIP-CHIP MOUNTING METHOD AND FLIP-CHIP MOUNT...

METHOD OF MANUFACTURING MOUNTING STRUCTURE AND MOUNTING STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

FLIP-CHIP MOUNTING METHOD, FLIP-CHIP MOUNTING APPARATUS AND TOOL PR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD...

ELECTRODE JUNCTION STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

MOUNTING STRUCTURE AND MOUNTING METHOD

ELECTRONIC COMPONENT AND RESIN PACKAGING METHOD FOR ELECTRONIC COMP...

ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME

Semiconductor Chip Assembly And Fabrication Method Therefor