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Kentaro Odanaka

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  • Tokyo, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20240139864
    • Publication date May 2, 2024
    • Disco Corporation
    • Hiroshi MORIKAZU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
    • Publication number 20240139863
    • Publication date May 2, 2024
    • Disco Corporation
    • Naotoshi KIRIHARA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
    • Publication number 20240123546
    • Publication date Apr 18, 2024
    • Disco Corporation
    • Naotoshi KIRIHARA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF PROCESSING WAFER AND LASER APPLYING APPARATUS
    • Publication number 20230377971
    • Publication date Nov 23, 2023
    • Disco Corporation
    • Keiji NOMARU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD OF CHIPS
    • Publication number 20230369116
    • Publication date Nov 16, 2023
    • Disco Corporation
    • Kentaro ODANAKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING WAFER AND LASER APPLYING APPARATUS
    • Publication number 20230369117
    • Publication date Nov 16, 2023
    • Disco Corporation
    • Kentaro ODANAKA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20230260854
    • Publication date Aug 17, 2023
    • Disco Corporation
    • Masatoshi WAKAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD AND WAFER PROCESSING APPARATUS
    • Publication number 20230066868
    • Publication date Mar 2, 2023
    • Disco Corporation
    • Kenya KAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD FOR DEVICE CHIP
    • Publication number 20220399235
    • Publication date Dec 15, 2022
    • Disco Corporation
    • Katsuhiko SUZUKI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROCESSING APPARATUS AND WORKPIECE PROCESSING METHOD
    • Publication number 20220301918
    • Publication date Sep 22, 2022
    • Disco Corporation
    • Yukiyasu MASUDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER PROCESSING APPARATUS AND METHOD OF CORRECTING CONVERGED SPOT...
    • Publication number 20220068729
    • Publication date Mar 3, 2022
    • Disco Corporation
    • Kentaro ODANAKA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD AND WAFER PROCESSING APPARATUS
    • Publication number 20210098298
    • Publication date Apr 1, 2021
    • Disco Corporation
    • Kenya KAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING APPARATUS AND WORKPIECE PROCESSING METHOD
    • Publication number 20200335377
    • Publication date Oct 22, 2020
    • Disco Corporation
    • Yukiyasu MASUDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200185227
    • Publication date Jun 11, 2020
    • Disco Corporation
    • Masatoshi WAKAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200051861
    • Publication date Feb 13, 2020
    • Disco Corporation
    • Meiyu PIAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200051862
    • Publication date Feb 13, 2020
    • Disco Corporation
    • Meiyu PIAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER PROCESSING APPARATUS AND OUTPUT POWER CHECKING METHOD
    • Publication number 20190101443
    • Publication date Apr 4, 2019
    • Disco Corporation
    • Kentaro ODANAKA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20180214986
    • Publication date Aug 2, 2018
    • Disco Corporation
    • Yuri Ban
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20180211852
    • Publication date Jul 26, 2018
    • Disco Corporation
    • Yuri Ban
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20170186656
    • Publication date Jun 29, 2017
    • Disco Corporation
    • Taku Iwamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER DIVIDING METHOD
    • Publication number 20170140989
    • Publication date May 18, 2017
    • Disco Corporation
    • Tomotaka Tabuchi
    • B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20170014947
    • Publication date Jan 19, 2017
    • Disco Corporation
    • Wataru Odagiri
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20160332260
    • Publication date Nov 17, 2016
    • Disco Corporation
    • Kentaro Odanaka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROTECTIVE FILM DETECTING METHOD
    • Publication number 20160266037
    • Publication date Sep 15, 2016
    • Disco Corporation
    • Senichi Ryo
    • G01 - MEASURING TESTING
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20160151857
    • Publication date Jun 2, 2016
    • Disco Corporation
    • Wataru Odagiri
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROTECTIVE FILM DETECTING APPARATUS AND PROTECTIVE FILM DETECTING M...
    • Publication number 20160125591
    • Publication date May 5, 2016
    • Disco Corporation
    • Yu Kudo
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20140305918
    • Publication date Oct 16, 2014
    • Disco Corporation
    • Tomoaki Endo
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20140206177
    • Publication date Jul 24, 2014
    • Disco Corporation
    • Yuki Ogawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Laser beam processing machine
    • Publication number 20070051710
    • Publication date Mar 8, 2007
    • DISCO CORPORATION
    • Kentaro Odanaka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Process for manufacturing a semiconductor chip
    • Publication number 20040266138
    • Publication date Dec 30, 2004
    • Keiichi Kajiyama
    • H01 - BASIC ELECTRIC ELEMENTS