Kentarou ISHIDA

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of helical chamfer machining silicon wafer
- Patent number 12,191,152
- Issue date Jan 7, 2025
- Sumco Corporation
- Kentarou Ishida
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF HELICAL CHAMFER MACHINING SILICON WAFER
- Publication number 20210327718
- Publication date Oct 21, 2021
- SUMCO CORPORATION
- Kentarou ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS