Kenya Kai

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Patents Grantslast 30 patents

Information Patent Grant
Wafer processing method and wafer processing apparatus
- Patent number 12,183,635
- Issue date Dec 31, 2024
- Disco Corporation
- Kenya Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Saw device manufacturing method
- Patent number 11,894,823
- Issue date Feb 6, 2024
- Disco Corporation
- Kenya Kai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wafer processing method and wafer processing apparatus
- Patent number 11,515,210
- Issue date Nov 29, 2022
- Disco Corporation
- Kenya Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate for acoustic wave device
- Patent number 11,165,408
- Issue date Nov 2, 2021
- Disco Corporation
- Jun Abatake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grinding apparatus
- Patent number 9,731,402
- Issue date Aug 15, 2017
- Disco Corporation
- Kenya Kai
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer processing method to remove crystal strains
- Patent number 9,613,795
- Issue date Apr 4, 2017
- Disco Corporation
- Hiroshi Morikazu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER PROCESSING METHOD AND WAFER PROCESSING APPARATUS
- Publication number 20230066868
- Publication date Mar 2, 2023
- Disco Corporation
- Kenya KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD AND WAFER PROCESSING APPARATUS
- Publication number 20210098298
- Publication date Apr 1, 2021
- Disco Corporation
- Kenya KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SAW DEVICE MANUFACTURING METHOD
- Publication number 20190326870
- Publication date Oct 24, 2019
- Disco Corporation
- Kenya KAI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE FOR ACOUSTIC WAVE DEVICE
- Publication number 20190044494
- Publication date Feb 7, 2019
- Disco Corporation
- Jun Abatake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GRINDING APPARATUS
- Publication number 20160129556
- Publication date May 12, 2016
- Disco Corporation
- Kenya Kai
- B24 - GRINDING POLISHING
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20150332910
- Publication date Nov 19, 2015
- Disco Corporation
- Hiroshi Morikazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etching device
- Publication number 20020026985
- Publication date Mar 7, 2002
- Kenya Kai
- H01 - BASIC ELECTRIC ELEMENTS