Kenya Tomioka

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Plating apparatus and plating liquid removing method
- Patent number 7,241,372
- Issue date Jul 10, 2007
- Ebara Corporation
- Satoshi Sendai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating apparatus and method
- Patent number 7,166,204
- Issue date Jan 23, 2007
- Ebara Corporation
- Satoshi Sendai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus and plating liquid removing method
- Patent number 6,689,216
- Issue date Feb 10, 2004
- Ebara Corporation
- Satoshi Sendai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating apparatus and method
- Patent number 6,660,139
- Issue date Dec 9, 2003
- Ebara Corporation
- Satoshi Sendai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plating substrate and plating facility
- Patent number 6,558,518
- Issue date May 6, 2003
- Ebara Corporation
- Satoshi Sendai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus for detecting the conductivity between plating co...
- Patent number 6,500,317
- Issue date Dec 31, 2002
- Ebara Corporation
- Junichiro Yoshioka
- G01 - MEASURING TESTING
Information Patent Grant
Wafer plating jig
- Patent number 6,365,020
- Issue date Apr 2, 2002
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Plating apparatus and method
- Publication number 20060185976
- Publication date Aug 24, 2006
- Satoshi Sendai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating liquid removing method
- Publication number 20040129575
- Publication date Jul 8, 2004
- Satoshi Sendai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and method
- Publication number 20040089555
- Publication date May 13, 2004
- Satoshi Sendai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and method
- Publication number 20030057098
- Publication date Mar 27, 2003
- Satoshi Sendai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating liquid removing method
- Publication number 20020017465
- Publication date Feb 14, 2002
- Satoshi Sendai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR