Kenzi Miyazima

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding apparatus for semiconductor device
- Patent number 4,466,565
- Issue date Aug 21, 1984
- Tokyo Shibaura Denki Kabushiki Kaisha
- Kenzi Miyazima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR