Kenzo Hatada

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 6,953,991
- Issue date Oct 11, 2005
- Shindo Company, Ltd.
- Kenzo Hatada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting apparatus with enhanced capability of removing heat
- Patent number 6,917,143
- Issue date Jul 12, 2005
- Matsushita Electric Industrial Co., Ltd.
- Nobuyuki Matsui
- F21 - LIGHTING
Information Patent Grant
Lighting apparatus whose light emitting elements are hard to be tak...
- Patent number 6,883,933
- Issue date Apr 26, 2005
- Matsushita Electric Industrial Co., Ltd.
- Nobuyuki Matsui
- F21 - LIGHTING
Information Patent Grant
Semiconductor chip and method manufacturing the same
- Patent number 6,492,255
- Issue date Dec 10, 2002
- Ibiden Co., Ltd.
- Ryo Enomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a lead clamping arrangement
- Patent number 5,998,866
- Issue date Dec 7, 1999
- Matsushita Electric Industrial Co., Ltd.
- Takao Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module having a vertical-cavity surface-emitting laser
- Patent number 5,796,714
- Issue date Aug 18, 1998
- Matsushita Electric Industrial Co., Ltd.
- Toyoji Chino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing said semiconductor device
- Patent number 5,783,463
- Issue date Jul 21, 1998
- Matsushita Electric Industrial Co., Ltd.
- Shinitsu Takehashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 5,776,802
- Issue date Jul 7, 1998
- Matsushita Electric Industrial Co., Ltd.
- Takao Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for bonding a semiconductor to a circuit substrate includin...
- Patent number 5,739,053
- Issue date Apr 14, 1998
- Matsushita Electric Industrial Co., Ltd.
- Tetuo Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device checking method
- Patent number 5,665,610
- Issue date Sep 9, 1997
- Matsushita Electric Industrial Co., Ltd.
- Yoshiro Nakata
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and method of producing said semiconductor device
- Patent number 5,640,044
- Issue date Jun 17, 1997
- Matsushita Electric Industrial Co., Ltd.
- Shinitsu Takehashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump electrode for connecting electronic components
- Patent number 5,477,087
- Issue date Dec 19, 1995
- Matsushita Electric Industrial Co., Ltd.
- Tetsuo Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic components mounting/connecting package and its fabricati...
- Patent number 5,336,547
- Issue date Aug 9, 1994
- Matsushita Electric Industrial Co. Ltd.
- Tetsuo Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 5,316,610
- Issue date May 31, 1994
- Matsushita Electric Industrial Co., Ltd.
- Tomohiro Tamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding lead with electrode of electronic device
- Patent number 5,316,204
- Issue date May 31, 1994
- Matsushita Electric Industrial Co., Ltd.
- Shinitsu Takehashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reduced diameter camera head for solid-state image pickup device an...
- Patent number 5,233,426
- Issue date Aug 3, 1993
- Matsushita Electric Industrial Co., Ltd.
- Takahisa Suzuki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Apparatus for connecting semiconductor devices to wiring boards
- Patent number 5,115,545
- Issue date May 26, 1992
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead connection structure
- Patent number 5,089,750
- Issue date Feb 18, 1992
- Matsushita Electric Industrial Co., Ltd.
- Kenzo Hatada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for testing semiconductor integrated circuits and method of...
- Patent number 5,089,772
- Issue date Feb 18, 1992
- Matsushita Electric Industrial Co. Ltd.
- Kenzo Hatada
- G01 - MEASURING TESTING
Information Patent Grant
Method of connecting electrodes
- Patent number 5,012,969
- Issue date May 7, 1991
- Matsushita Electric Industrial Co., Ltd.
- Kenzo Hatada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack type semiconductor package
- Patent number 4,996,583
- Issue date Feb 26, 1991
- Matsushita Electric Industrial Co., Ltd.
- Kenzo Hatada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead connection structure
- Patent number 4,959,590
- Issue date Sep 25, 1990
- Matsushita Electric Industrial Co., Ltd.
- Kenzo Hatada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method
- Patent number 4,876,221
- Issue date Oct 24, 1989
- Matsushita Electric Industrial Co., Ltd.
- Kenzo Hatada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of joining beam leads with projections to device electrodes
- Patent number 4,784,972
- Issue date Nov 15, 1988
- Matsushita Electric Industrial Co. Ltd.
- Kenzo Hatada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel assembly having a plurality of film carrier tapes on...
- Patent number 4,766,426
- Issue date Aug 23, 1988
- Matsushita Electric Industrial Co., Ltd.
- Kenzo Hatada
- G02 - OPTICS
Information Patent Grant
Method of connecting a semiconductor device to a wiring board
- Patent number 4,749,120
- Issue date Jun 7, 1988
- Matsushita Electric Industrial Co., Ltd.
- Kenzo Hatada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor devices together
- Patent number 4,693,770
- Issue date Sep 15, 1987
- Matsushita Electric Industrial Co., Ltd.
- Kenzo Hatada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure of flat device
- Patent number 4,684,974
- Issue date Aug 4, 1987
- Matsushita Electric Industrial Co. Ltd.
- Koji Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of connecting metal leads with electrodes of semiconductor d...
- Patent number 4,494,688
- Issue date Jan 22, 1985
- Matsushita Electric Industrial Co., Ltd.
- Kenzo Hatada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making metal electrode of semiconductor device
- Patent number 4,293,637
- Issue date Oct 6, 1981
- Matsushita Electric Industrial Co., Ltd.
- Kenzo Hatada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device
- Publication number 20040251536
- Publication date Dec 16, 2004
- Kenzo Hatada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lighting apparatus with enhanced capability of removing heat
- Publication number 20030052584
- Publication date Mar 20, 2003
- Nobuyuki Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lighting apparatus whose light emitting elements are hard to be tak...
- Publication number 20030052594
- Publication date Mar 20, 2003
- Nobuyuki Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip and method manufacturing the same
- Publication number 20010049187
- Publication date Dec 6, 2001
- IBIDEN, CO., LTD.
- Ryo Enomoto
- H01 - BASIC ELECTRIC ELEMENTS

Kenzo Hatada

Person

Patents Grantslast 30 patents

Semiconductor device

Lighting apparatus with enhanced capability of removing heat

Lighting apparatus whose light emitting elements are hard to be tak...

Semiconductor chip and method manufacturing the same

Semiconductor device having a lead clamping arrangement

Optical module having a vertical-cavity surface-emitting laser

Semiconductor device and method of producing said semiconductor device

Semiconductor device and manufacturing method of the same

Process for bonding a semiconductor to a circuit substrate includin...

Semiconductor device checking method

Semiconductor device and method of producing said semiconductor device

Bump electrode for connecting electronic components

Electronic components mounting/connecting package and its fabricati...

Bonding apparatus

Method for bonding lead with electrode of electronic device

Reduced diameter camera head for solid-state image pickup device an...

Apparatus for connecting semiconductor devices to wiring boards

Lead connection structure

Device for testing semiconductor integrated circuits and method of...

Method of connecting electrodes

Stack type semiconductor package

Lead connection structure

Bonding method

Method of joining beam leads with projections to device electrodes

Display panel assembly having a plurality of film carrier tapes on...

Method of connecting a semiconductor device to a wiring board

Method of bonding semiconductor devices together

Electrode connection structure of flat device

Method of connecting metal leads with electrodes of semiconductor d...

Method of making metal electrode of semiconductor device

Patents Applicationslast 30 patents

Semiconductor device

Lighting apparatus with enhanced capability of removing heat

Lighting apparatus whose light emitting elements are hard to be tak...

Semiconductor chip and method manufacturing the same