KENZO ISHIDA

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Patents Grantslast 30 patents

Information Patent Grant
Easy mount socket
- Patent number 6,785,148
- Issue date Aug 31, 2004
- Intel Corporation
- Kenzo Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-additive process (SAP) architecture for organic leadless grid...
- Patent number 6,278,185
- Issue date Aug 21, 2001
- Intel Corporation
- Venkatesan Murali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling unit for an integrated circuit package
- Patent number 6,173,576
- Issue date Jan 16, 2001
- Intel Corporation
- Kenzo Ishida
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Printed circuit substrate with solder formed on pad-on-via and pad-...
- Patent number 6,020,561
- Issue date Feb 1, 2000
- Intel Corporation
- Kenzo Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling solder bump height and volume for substrates...
- Patent number 5,660,321
- Issue date Aug 26, 1997
- Intel Corporation
- Kenzo Ishida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INJECTION MOLDED UNDERFILL PACKAGE AND METHOD OF ASSEMBLY
- Publication number 20020089836
- Publication date Jul 11, 2002
- KENZO ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS