Kenzo Takemura

Person

Yuki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 8,273,458
- Issue date Sep 25, 2012
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 8,273,457
- Issue date Sep 25, 2012
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 8,252,419
- Issue date Aug 28, 2012
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 7,879,445
- Issue date Feb 1, 2011
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for bonding circuit members, circuit board, and method of...
- Patent number 7,247,381
- Issue date Jul 24, 2007
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection sheet and electrode connection structure for electricall...
- Patent number 6,338,195
- Issue date Jan 15, 2002
- Hitachi Chemical Company, Ltd.
- Isao Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filmy adhesive for connecting circuits and circuit board
- Patent number 6,328,844
- Issue date Dec 11, 2001
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of production of semiconductor device
- Patent number 6,223,429
- Issue date May 1, 2001
- Hitachi Chemical Company, Ltd.
- Aizou Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component parts device
- Patent number 6,184,577
- Issue date Feb 6, 2001
- Hitachi Chemical Company, Ltd.
- Kenzo Takemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection sheet and electrode connection structure for electricall...
- Patent number 6,034,331
- Issue date Mar 7, 2000
- Hitachi Chemical Company, Ltd.
- Isao Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...
- Publication number 20110247867
- Publication date Oct 13, 2011
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...
- Publication number 20110247874
- Publication date Oct 13, 2011
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...
- Publication number 20110247873
- Publication date Oct 13, 2011
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...
- Publication number 20090314533
- Publication date Dec 24, 2009
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive for bonding circuit members, circuit board and process for...
- Publication number 20070137887
- Publication date Jun 21, 2007
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kenzo Takemura

Person

Patents Grantslast 30 patents

Adhesive for bonding circuit members, circuit board and process for...

Adhesive for bonding circuit members, circuit board and process for...

Adhesive for bonding circuit members, circuit board and process for...

Adhesive for bonding circuit members, circuit board and process for...

Adhesive for bonding circuit members, circuit board, and method of...

Connection sheet and electrode connection structure for electricall...

Filmy adhesive for connecting circuits and circuit board

Method of production of semiconductor device

Electronic component parts device

Connection sheet and electrode connection structure for electricall...

Patents Applicationslast 30 patents

ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...

ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...

ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...

ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...

Adhesive for bonding circuit members, circuit board and process for...