Kenzou Hatada

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer package, method and apparatus for connecting te...
- Patent number 6,323,663
- Issue date Nov 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Yoshirou Nakata
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer package, method and apparatus for connecting te...
- Patent number 6,005,401
- Issue date Dec 21, 1999
- Matsushita Electric Industrial Co., Ltd.
- Yoshirou Nakata
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer package, method and apparatus for connecting te...
- Patent number 5,945,834
- Issue date Aug 31, 1999
- Matsushita Electric Industrial Co., Ltd.
- Yoshirou Nakata
- G01 - MEASURING TESTING