Kenzou Mejima

Follow

Person

Tochigi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for bonding semiconductor wafers and method for manufacturin...
- Patent number 8,039,305
- Issue date Oct 18, 2011
- Sumitomo Bakelite Company, Ltd.
- Kenzou Mejima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR WAFERS AND METHOD FOR MANUFACTURIN...
- Publication number 20100129960
- Publication date May 27, 2010
- SUMITOMO BAKELITE COMPANY LIMITED
- Kenzou Mejima
- H01 - BASIC ELECTRIC ELEMENTS