KeoChang Lee

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Icheon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming partition fence and shie...
- Patent number 10,418,332
- Issue date Sep 17, 2019
- STATS ChipPAC Pte. Ltd.
- Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer support structu...
- Patent number 9,859,200
- Issue date Jan 2, 2018
- STATS ChipPAC Pte. Ltd.
- SooSan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of mitigating defects for semiconductor packages
- Patent number 9,184,067
- Issue date Nov 10, 2015
- Stats Chippac Ltd.
- KyungHwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided film-assist molding process
- Patent number 9,076,802
- Issue date Jul 7, 2015
- Stats Chippac Ltd.
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Partition Fence and Shie...
- Publication number 20180261551
- Publication date Sep 13, 2018
- STATS ChipPAC Pte Ltd.
- Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER SUPPORT STRUCTU...
- Publication number 20160190054
- Publication date Jun 30, 2016
- SooSan Park
- H01 - BASIC ELECTRIC ELEMENTS