Keon Yang Park

Follow

Person

Taejeon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing build-up multi-layer printed circuit board...
- Patent number 6,405,431
- Issue date Jun 18, 2002
- Samsung Electro-Mechanics Co., Ltd.
- Dong Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing build-up multi-layer printed circuit board
- Patent number 5,837,427
- Issue date Nov 17, 1998
- Samsung Electro-Mechanics Co Co., Ltd.
- Se Meyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS