Keonsoo JANG

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Laser bonding method
- Patent number 11,107,790
- Issue date Aug 31, 2021
- Electronics and Telecommunications Research Institute
- Kwang-Seong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and methods of forming solder bump and flip chip using...
- Patent number 9,462,736
- Issue date Oct 4, 2016
- Electronics and Telecommunications Research Institute
- Yong Sung Eom
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composition and methods of forming solder bump and flip chip using...
- Patent number 9,155,236
- Issue date Oct 6, 2015
- Electronics and Telecommunications Research Institute
- Yong Sung Eom
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composition and methods of forming solder bump and flip chip using...
- Patent number 8,802,760
- Issue date Aug 12, 2014
- Electronics and Telecommunications Research Institute
- Yong Sung Eom
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composition and methods of forming solder bump and flip chip using...
- Patent number 8,420,722
- Issue date Apr 16, 2013
- Electronics and Telecommunications Research Institute
- Yong Sung Eom
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LASER BONDING METHOD AND A SEMICONDUCTOR PACKAGE INCLUDING A BONDIN...
- Publication number 20210358885
- Publication date Nov 18, 2021
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDING METHOD
- Publication number 20200075535
- Publication date Mar 5, 2020
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
- Publication number 20140317915
- Publication date Oct 30, 2014
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- B82 - NANO-TECHNOLOGY
Information Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
- Publication number 20140317918
- Publication date Oct 30, 2014
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- B82 - NANO-TECHNOLOGY
Information Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
- Publication number 20130200135
- Publication date Aug 8, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- B82 - NANO-TECHNOLOGY
Information Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
- Publication number 20100006625
- Publication date Jan 14, 2010
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Keonsoo JANG

Person

Patents Grantslast 30 patents

Laser bonding method

Composition and methods of forming solder bump and flip chip using...

Composition and methods of forming solder bump and flip chip using...

Composition and methods of forming solder bump and flip chip using...

Composition and methods of forming solder bump and flip chip using...

Patents Applicationslast 30 patents

LASER BONDING METHOD AND A SEMICONDUCTOR PACKAGE INCLUDING A BONDIN...

LASER BONDING METHOD

COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...

COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...

COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...

COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...