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KeonTaek Kang
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Kyoungki-do, KR
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor device and method of individual die bonding followed...
Patent number
9,524,958
Issue date
Dec 20, 2016
STATS ChipPAC Pte. Ltd.
JoonYoung Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of manufacturing flip chip semiconductor packages using dou...
Patent number
9,252,130
Issue date
Feb 2, 2016
STATS ChipPAC, Ltd.
KyungMoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Semiconductor Device and Method of Individual Die Bonding Followed...
Publication number
20150001703
Publication date
Jan 1, 2015
STATS ChipPAC, Ltd.
JoonYoung Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods of Manufacturing Flip Chip Semiconductor Packages Using Dou...
Publication number
20140295618
Publication date
Oct 2, 2014
STATS ChipPAC, Ltd.
KyungMoon Kim
H01 - BASIC ELECTRIC ELEMENTS