Kerry Bernstein

Person

Underhill, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Assembly including plural through wafer vias, method of cooling the...
- Patent number 11,967,548
- Issue date Apr 23, 2024
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly including plural through wafer vias, method of cooling the...
- Patent number 10,622,294
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly including plural through wafer vias, method of cooling the...
- Patent number 10,586,760
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly including plural through wafer vias, method of cooling the...
- Patent number 9,905,505
- Issue date Feb 27, 2018
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly including plural through wafer vias, method of cooling the...
- Patent number 9,905,506
- Issue date Feb 27, 2018
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of masking electromagnetic interference (EMI) emi...
- Patent number 9,496,981
- Issue date Nov 15, 2016
- GLOBALFOUNDRIES Inc.
- Kerry Bernstein
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Auto-compensating temperature valve controller for electro-rheologi...
- Patent number 9,301,424
- Issue date Mar 29, 2016
- International Business Machines Corporation
- Kerry Bernstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reactive metal optical security device and methods of fabrication a...
- Patent number 9,264,150
- Issue date Feb 16, 2016
- GLOBALFOUNDRIES Inc.
- Kerry Bernstein
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Auto-compensating temperature valve controller for electro-rheologi...
- Patent number 9,257,366
- Issue date Feb 9, 2016
- International Business Machines Corporation
- Kerry Bernstein
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL
Information Patent Grant
Assembly including plural through wafer vias, method of cooling the...
- Patent number 9,252,071
- Issue date Feb 2, 2016
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly including plural through wafer vias, method of cooling the...
- Patent number 9,252,072
- Issue date Feb 2, 2016
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for normalizing strain in semicondcutor devices and strain...
- Patent number 9,082,875
- Issue date Jul 14, 2015
- International Business Machines Corporation
- Bruce Balch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detecting chip alterations with light emission
- Patent number 9,075,106
- Issue date Jul 7, 2015
- International Business Machines Corporation
- Kerry Bernstein
- G01 - MEASURING TESTING
Information Patent Grant
Electro-rheological micro-channel anisotropic cooled integrated cir...
- Patent number 9,052,724
- Issue date Jun 9, 2015
- International Business Machines Corporation
- Kerry Bernstein
- G05 - CONTROLLING REGULATING
Information Patent Grant
In-plane silicon heat spreader and method therefor
- Patent number 8,853,007
- Issue date Oct 7, 2014
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply for localized portions of an integrated circuit
- Patent number 8,736,353
- Issue date May 27, 2014
- International Business Machines Corporation
- Kerry Bernstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Test structure and methodology for three-dimensional semiconductor...
- Patent number 8,729,549
- Issue date May 20, 2014
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided integrated circuit chips
- Patent number 8,689,152
- Issue date Apr 1, 2014
- International Business Machines Corporation
- Kerry Bernstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip stacking for redundancy and yield improvement
- Patent number 8,686,559
- Issue date Apr 1, 2014
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly including plural through wafer vias, method of cooling the...
- Patent number 8,629,554
- Issue date Jan 14, 2014
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip stacking for redundancy and yield improvement
- Patent number 8,597,960
- Issue date Dec 3, 2013
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer 3D CAM cell
- Patent number 8,576,599
- Issue date Nov 5, 2013
- International Business Machines Corporation
- Jagreet S. Atwal
- G11 - INFORMATION STORAGE
Information Patent Grant
Inactivity triggered self clocking logic family
- Patent number 8,575,964
- Issue date Nov 5, 2013
- International Business Machines Corporation
- Kerry Bernstein
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
BEOL compatible FET structrure
- Patent number 8,569,803
- Issue date Oct 29, 2013
- International Business Machines Corporation
- Christy S. Tyberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact multi-port CAM cell implemented in 3D vertical integration
- Patent number 8,513,791
- Issue date Aug 20, 2013
- International Business Machines Corporation
- Robert J. Bucki
- G11 - INFORMATION STORAGE
Information Patent Grant
Assembly including plural through wafer vias, method of cooling the...
- Patent number 8,487,427
- Issue date Jul 16, 2013
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided integrated circuit chips
- Patent number 8,471,306
- Issue date Jun 25, 2013
- International Business Machines Corporation
- Kerry Bernstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
BEOL compatible FET structure
- Patent number 8,441,042
- Issue date May 14, 2013
- International Business Machines Corporation
- Christy S. Tyberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided integrated circuit chips
- Patent number 8,421,126
- Issue date Apr 16, 2013
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for target-based compact modeling
- Patent number 8,417,503
- Issue date Apr 9, 2013
- International Business Machines Corporation
- Kerry Bernstein
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...
- Publication number 20200144169
- Publication date May 7, 2020
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...
- Publication number 20180090427
- Publication date Mar 29, 2018
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...
- Publication number 20180090428
- Publication date Mar 29, 2018
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...
- Publication number 20160049360
- Publication date Feb 18, 2016
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...
- Publication number 20160049353
- Publication date Feb 18, 2016
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Auto-Compensating Temperature Valve Controller for Electro-Rheologi...
- Publication number 20160037682
- Publication date Feb 4, 2016
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Auto-Compensating Temperature Valve Controller for Electro-Rheologi...
- Publication number 20150116939
- Publication date Apr 30, 2015
- International Business Machines Corporation
- Kerry Bernstein
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL
Information Patent Application
BEOL COMPATIBLE FET STRUCTURE
- Publication number 20150060856
- Publication date Mar 5, 2015
- International Business Machines Corporation
- Christy S. TYBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...
- Publication number 20140084443
- Publication date Mar 27, 2014
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...
- Publication number 20140084448
- Publication date Mar 27, 2014
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY FOR LOCALIZED PORTIONS OF AN INTEGRATED CIRCUIT
- Publication number 20140077871
- Publication date Mar 20, 2014
- International Business Machines Corporation
- Kerry Bernstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRO-RHEOLOGICAL MICRO-CHANNEL ANISOTROPIC COOLED INTEGRATED CIR...
- Publication number 20140043757
- Publication date Feb 13, 2014
- International Business Machines Corporation
- Kerry Bernstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REACTIVE METAL OPTICAL SECURITY DEVICE AND METHODS OF FABRICATION A...
- Publication number 20130259488
- Publication date Oct 3, 2013
- International Business Machines Corporation
- Kerry BERNSTEIN
- G02 - OPTICS
Information Patent Application
INACTIVITY TRIGGERED SELF CLOCKING LOGIC FAMILY
- Publication number 20130249596
- Publication date Sep 26, 2013
- International Business Machines Corporation
- Kerry Bernstein
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT CHIPS
- Publication number 20130179853
- Publication date Jul 11, 2013
- International Business Machines Corporation
- Kerry Bernstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS FOR NORMALIZING STRAIN IN SEMICONDCUTOR DEVICES AND STRAIN...
- Publication number 20130032894
- Publication date Feb 7, 2013
- International Business Machines Corporation
- Bruce Balch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STACKING FOR REDUNDANCY AND YIELD IMPROVEMENT
- Publication number 20120326333
- Publication date Dec 27, 2012
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL COMPATIBLE FET STRUCTRURE
- Publication number 20120305929
- Publication date Dec 6, 2012
- International Business Machines Corporation
- Christy S. Tyberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCTURE AND METHODOLOGY FOR THREE-DIMENSIONAL SEMICONDUCTOR...
- Publication number 20120262197
- Publication date Oct 18, 2012
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCTURE AND METHODOLOGY FOR THREE-DIMENSIONAL SEMICONDUCTOR...
- Publication number 20120264241
- Publication date Oct 18, 2012
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER 3D CAM CELL
- Publication number 20120127771
- Publication date May 24, 2012
- International Business Machines Corporation
- Jagreet S. Atwal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEEP TRENCH ELECTROSTATIC DISCHARGE (ESD) PROTECT DIODE FOR SILICON...
- Publication number 20120083091
- Publication date Apr 5, 2012
- International Business Machines Corporation
- John E. Barth, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DESIGNING AN INTEGRATED CIRCUIT BASED ON A COMBINATION OF...
- Publication number 20120066657
- Publication date Mar 15, 2012
- International Business Machines Corporation
- Kerry Bernstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IN-PLANE SILICON HEAT SPREADER AND METHOD THEREFOR
- Publication number 20120031603
- Publication date Feb 9, 2012
- International Business Machines Corporation
- Kerry BERNSTEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT CHIPS
- Publication number 20110302542
- Publication date Dec 8, 2011
- International Business Machines Corporation
- Kerry Bernstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT CHIPS
- Publication number 20110241082
- Publication date Oct 6, 2011
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR FOR SOI CMOS DEVICES FOR SOFT ERROR IMMUNITY
- Publication number 20110177660
- Publication date Jul 21, 2011
- International Business Machines Corporation
- John E. Barth, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI BODY CONTACT USING E-DRAM TECHNOLOGY
- Publication number 20110177659
- Publication date Jul 21, 2011
- International Business Machines Corporation
- John E. Barth, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adaptive Linesize in a Cache
- Publication number 20110078382
- Publication date Mar 31, 2011
- International Business Machines Corporation
- Kerry Bernstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Detecting Chip Alterations with Light Emission
- Publication number 20110026806
- Publication date Feb 3, 2011
- International Business Machines Corporation
- Kerry Bernstein
- G01 - MEASURING TESTING

Kerry Bernstein

Person

Patents Grantslast 30 patents

Assembly including plural through wafer vias, method of cooling the...

Assembly including plural through wafer vias, method of cooling the...

Assembly including plural through wafer vias, method of cooling the...

Assembly including plural through wafer vias, method of cooling the...

Assembly including plural through wafer vias, method of cooling the...

System and method of masking electromagnetic interference (EMI) emi...

Auto-compensating temperature valve controller for electro-rheologi...

Reactive metal optical security device and methods of fabrication a...

Auto-compensating temperature valve controller for electro-rheologi...

Assembly including plural through wafer vias, method of cooling the...

Assembly including plural through wafer vias, method of cooling the...

Methods for normalizing strain in semicondcutor devices and strain...

Detecting chip alterations with light emission

Electro-rheological micro-channel anisotropic cooled integrated cir...

In-plane silicon heat spreader and method therefor

Power supply for localized portions of an integrated circuit

Test structure and methodology for three-dimensional semiconductor...

Double-sided integrated circuit chips

Semiconductor chip stacking for redundancy and yield improvement

Assembly including plural through wafer vias, method of cooling the...

Semiconductor chip stacking for redundancy and yield improvement

Multi-wafer 3D CAM cell

Inactivity triggered self clocking logic family

BEOL compatible FET structrure

Compact multi-port CAM cell implemented in 3D vertical integration

Assembly including plural through wafer vias, method of cooling the...

Double-sided integrated circuit chips

BEOL compatible FET structure

Double-sided integrated circuit chips

System and method for target-based compact modeling

Patents Applicationslast 30 patents

ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...

ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...

ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...

ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...

ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...

Auto-Compensating Temperature Valve Controller for Electro-Rheologi...

Auto-Compensating Temperature Valve Controller for Electro-Rheologi...

BEOL COMPATIBLE FET STRUCTURE

ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...

ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...

POWER SUPPLY FOR LOCALIZED PORTIONS OF AN INTEGRATED CIRCUIT

ELECTRO-RHEOLOGICAL MICRO-CHANNEL ANISOTROPIC COOLED INTEGRATED CIR...

REACTIVE METAL OPTICAL SECURITY DEVICE AND METHODS OF FABRICATION A...

INACTIVITY TRIGGERED SELF CLOCKING LOGIC FAMILY

DOUBLE-SIDED INTEGRATED CIRCUIT CHIPS

METHODS FOR NORMALIZING STRAIN IN SEMICONDCUTOR DEVICES AND STRAIN...

SEMICONDUCTOR CHIP STACKING FOR REDUNDANCY AND YIELD IMPROVEMENT

BEOL COMPATIBLE FET STRUCTRURE

TEST STRUCTURE AND METHODOLOGY FOR THREE-DIMENSIONAL SEMICONDUCTOR...

TEST STRUCTURE AND METHODOLOGY FOR THREE-DIMENSIONAL SEMICONDUCTOR...

MULTI-WAFER 3D CAM CELL

DEEP TRENCH ELECTROSTATIC DISCHARGE (ESD) PROTECT DIODE FOR SILICON...

METHOD OF DESIGNING AN INTEGRATED CIRCUIT BASED ON A COMBINATION OF...

IN-PLANE SILICON HEAT SPREADER AND METHOD THEREFOR

DOUBLE-SIDED INTEGRATED CIRCUIT CHIPS

DOUBLE-SIDED INTEGRATED CIRCUIT CHIPS

DEEP TRENCH CAPACITOR FOR SOI CMOS DEVICES FOR SOFT ERROR IMMUNITY

SOI BODY CONTACT USING E-DRAM TECHNOLOGY

Adaptive Linesize in a Cache

Detecting Chip Alterations with Light Emission