TREA

Kesav Kumar SRIDHARAN

Follow

Person

  • Bengaluru, IN
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Through board via heat sink
    • Patent number 11,825,593
    • Issue date Nov 21, 2023
    • Aptiv Technologies Limited
    • Navneet Gupta
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    THROUGH BOARD VIA HEAT SINK
    • Publication number 20240057246
    • Publication date Feb 15, 2024
    • Aptiv Technologies Limited
    • Navneet GUPTA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Sheet Metal Enclosure with an Array of Extruded Heat Transfer Holes
    • Publication number 20230415680
    • Publication date Dec 28, 2023
    • Aptiv Technologies Limited
    • Shrikant Bhadri
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    METALIZED PLASTIC HOUSING ENCLOSURE HEAT SINK
    • Publication number 20230408636
    • Publication date Dec 21, 2023
    • Aptiv Technologies Limited
    • Kesav Kumar Sridharan
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    THROUGH BOARD VIA HEAT SINK
    • Publication number 20220418086
    • Publication date Dec 29, 2022
    • Aptiv Technologies Limited
    • Navneet GUPTA
    • H01 - BASIC ELECTRIC ELEMENTS