Keum-Hee Ma

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 9,515,057
- Issue date Dec 6, 2016
- Samsung Electronics Co., Ltd.
- Keum-hee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having through electrodes and methods for fa...
- Patent number 9,245,771
- Issue date Jan 26, 2016
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package having semiconductor chips of different thicknes...
- Patent number 8,513,802
- Issue date Aug 20, 2013
- Samsung Electronics Co., Ltd.
- Keum-Hee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack package and method of fabricating the same
- Patent number 8,373,261
- Issue date Feb 12, 2013
- Samsung Electronics Co., Ltd.
- Pyoung-wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via structures providing reduced solder spreading a...
- Patent number 8,183,673
- Issue date May 22, 2012
- Samsung Electronics Co., Ltd.
- Son-Kwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing the semiconductor device
- Patent number 8,114,772
- Issue date Feb 14, 2012
- Samsung Electronics Co., Ltd.
- Kyu-Ha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 7,777,323
- Issue date Aug 17, 2010
- Samsung Electronics Co., Ltd.
- Yong Chai Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of stacking semiconductor devices and methods of fabricatin...
- Patent number 7,588,964
- Issue date Sep 15, 2009
- Samsung Electronics Co., Ltd.
- Yong-Chai Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and method of manufacturing the same
- Patent number 7,534,656
- Issue date May 19, 2009
- Samsung Electronics Co., Ltd.
- Yong-Chai Kwon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fabrication method of wafer level chip scale packages
- Patent number 7,524,763
- Issue date Apr 28, 2009
- Samsung Electronics Co., Ltd.
- Soon-Bum Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly having wafer with image sensor chips, a photo-sensitive ad...
- Patent number 7,521,657
- Issue date Apr 21, 2009
- Samsung Electronics Co., Ltd.
- Yong-Chai Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip package using photosensitive polymer and manufacturing...
- Patent number 7,459,774
- Issue date Dec 2, 2008
- Samsung Electronics Co., Ltd.
- Yong-Chai Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and methods thereof
- Patent number 7,371,614
- Issue date May 13, 2008
- Samsung Electronics Co., Ltd.
- Yong-Chai Kwon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for forming solder bump structure
- Patent number 7,300,864
- Issue date Nov 27, 2007
- Samsung Electronics Co., Ltd.
- Keum-Hee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and method of manufacturing same
- Patent number 7,262,475
- Issue date Aug 28, 2007
- Samsung Electronics Co., Ltd.
- Yong-Chai Kwon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCT...
- Publication number 20220392859
- Publication date Dec 8, 2022
- Samsung Electronics Co., Ltd.
- Keum Hee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150228591
- Publication date Aug 13, 2015
- Samsung Electronics Co., Ltd.
- Ji-Hwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20150130030
- Publication date May 14, 2015
- Keum-hee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING THROUGH ELECTRODES AND METHODS FOR FA...
- Publication number 20140377909
- Publication date Dec 25, 2014
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20140252605
- Publication date Sep 11, 2014
- Samsung Electronics Co., Ltd.
- Keum-Hee MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Package Having Semiconductor Chips Of Different Thicknes...
- Publication number 20110193229
- Publication date Aug 11, 2011
- Samsung Electronics Co., Ltd.
- Keum-Hee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing the Semiconductor Device
- Publication number 20110097891
- Publication date Apr 28, 2011
- Kyu-Ha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip stack package and method of fabricating the same
- Publication number 20100244233
- Publication date Sep 30, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Pyoung-wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA STRUCTURES PROVIDING REDUCED SOLDER SPREADING A...
- Publication number 20100096753
- Publication date Apr 22, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Son-Kwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH EMBEDDED INTERPOSER
- Publication number 20100081236
- Publication date Apr 1, 2010
- Samsung Electronics Co., Ltd.
- Se-Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device packages and methods of fabricating the same
- Publication number 20090186446
- Publication date Jul 23, 2009
- Samsung Electronics Co., Ltd.
- Yong-Chai Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack circuit member and method
- Publication number 20080318363
- Publication date Dec 25, 2008
- Yong-Chai Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING IMMUNITY AGAINST VOID DUE TO ADHESIVE...
- Publication number 20080179727
- Publication date Jul 31, 2008
- Samsung Electronics Co., Ltd.
- Yong-Chai KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked structure of semiconductor devices, semiconductor device pa...
- Publication number 20080169545
- Publication date Jul 17, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Yong-Chai Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED-TYPE WAFER LEVEL PACKAGE, METHOD OF MANUFACTURING THE SAME,...
- Publication number 20080001289
- Publication date Jan 3, 2008
- Samsung Electronics Co., Ltd.
- Keum-Hee MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20070284729
- Publication date Dec 13, 2007
- Yong-Chal Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor device and method of manufacturing the same
- Publication number 20070264745
- Publication date Nov 15, 2007
- Yong-Chai Kwon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Stacked chip package using warp preventing insulative material and...
- Publication number 20070045836
- Publication date Mar 1, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Yong-Chai Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked chip package using photosensitive polymer and manufacturing...
- Publication number 20070048969
- Publication date Mar 1, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Yong-Chai Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor device and methods thereof
- Publication number 20070019089
- Publication date Jan 25, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Yong-Chai Kwon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Chip-embedded interposer structure and fabrication method thereof,...
- Publication number 20070007641
- Publication date Jan 11, 2007
- Kang-Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack circuit member and method
- Publication number 20060278991
- Publication date Dec 14, 2006
- Yong-Chai Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor chip having plate, wafer assembly and manufacturing me...
- Publication number 20060152615
- Publication date Jul 13, 2006
- Yong-Chai Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor device and method of manufacturing same
- Publication number 20060151847
- Publication date Jul 13, 2006
- Yong-Chai Kwon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Fabrication method of wafer level chip scale packages
- Publication number 20050277293
- Publication date Dec 15, 2005
- Soon-Bum Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for forming solder bump structure
- Publication number 20050090089
- Publication date Apr 28, 2005
- Keum-Hee Ma
- H01 - BASIC ELECTRIC ELEMENTS

Keum-Hee Ma

Person

Patents Grantslast 30 patents

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor packages having through electrodes and methods for fa...

Multi-chip package having semiconductor chips of different thicknes...

Chip stack package and method of fabricating the same

Through-silicon via structures providing reduced solder spreading a...

Method of manufacturing the semiconductor device

Semiconductor structure and method for forming the same

Methods of stacking semiconductor devices and methods of fabricatin...

Image sensor device and method of manufacturing the same

Fabrication method of wafer level chip scale packages

Assembly having wafer with image sensor chips, a photo-sensitive ad...

Stacked chip package using photosensitive polymer and manufacturing...

Image sensor device and methods thereof

Method for forming solder bump structure

Image sensor device and method of manufacturing same

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGES HAVING THROUGH ELECTRODES AND METHODS FOR FA...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Multi-Chip Package Having Semiconductor Chips Of Different Thicknes...

Method of Manufacturing the Semiconductor Device

Chip stack package and method of fabricating the same

THROUGH-SILICON VIA STRUCTURES PROVIDING REDUCED SOLDER SPREADING A...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH EMBEDDED INTERPOSER

Semiconductor device packages and methods of fabricating the same

Stack circuit member and method

SEMICONDUCTOR PACKAGES HAVING IMMUNITY AGAINST VOID DUE TO ADHESIVE...

Stacked structure of semiconductor devices, semiconductor device pa...

STACKED-TYPE WAFER LEVEL PACKAGE, METHOD OF MANUFACTURING THE SAME,...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

Image sensor device and method of manufacturing the same

Stacked chip package using warp preventing insulative material and...

Stacked chip package using photosensitive polymer and manufacturing...

Image sensor device and methods thereof

Chip-embedded interposer structure and fabrication method thereof,...

Stack circuit member and method

Image sensor chip having plate, wafer assembly and manufacturing me...

Image sensor device and method of manufacturing same

Fabrication method of wafer level chip scale packages

Method for forming solder bump structure