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Keumhee Ma
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Gyeongsangbuk-do, KR
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last 30 patents
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Patent Grant
Through-silicon via structures including conductive protective layers
Patent number
8,026,592
Issue date
Sep 27, 2011
Samsung Electronics Co., Ltd.
Minseung Yoon
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
METHODS OF FORMING THROUGH-SILICON VIA STRUCTURES INCLUDING CONDUCT...
Publication number
20110318917
Publication date
Dec 29, 2011
Minseung Yoon
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
THROUGH-SILICON VIA STRUCTURES INCLUDING CONDUCTIVE PROTECTIVE LAYE...
Publication number
20100038800
Publication date
Feb 18, 2010
SAMSUNG ELECTRONICS CO., LTD.
Minseung Yoon
H01 - BASIC ELECTRIC ELEMENTS