Keun-Ho CHOI

Person

Asan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding wire, semiconductor package including the same, and wire bo...
- Patent number 12,243,846
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Keun-ho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,764,121
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Keun-Ho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,450,583
- Issue date Sep 20, 2022
- Samsung Electronics Co., Ltd.
- Keun-Ho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire, semiconductor package including the same, and wire bo...
- Patent number 11,094,666
- Issue date Aug 17, 2021
- Samsung Electronics Co., Ltd.
- Keun-Ho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,111,913
- Issue date Aug 18, 2015
- Samsung Electronics Co., Ltd.
- Keun Ho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 9,054,105
- Issue date Jun 9, 2015
- Samsung Electronics Co., Ltd.
- Keun-Ho Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220415740
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- Keun-Ho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND WIRE BO...
- Publication number 20210351153
- Publication date Nov 11, 2021
- Samsung Electronics Co., Ltd.
- Keun-Ho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20200105637
- Publication date Apr 2, 2020
- Samsung Electronics Co., Ltd.
- Keun-Ho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND WIRE BO...
- Publication number 20200105708
- Publication date Apr 2, 2020
- Samsung Electronics Co., Ltd.
- Keun-Ho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE
- Publication number 20150091168
- Publication date Apr 2, 2015
- Samsung Electronics Co., Ltd.
- Keun-Ho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20140374893
- Publication date Dec 25, 2014
- KEUN HO CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20140021608
- Publication date Jan 23, 2014
- Samsunung Electronics., Ltd.
- KEUN-HO CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140008796
- Publication date Jan 9, 2014
- Keun-Ho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, STACK MODULE, CARD, AND ELECTRONIC SYSTEM
- Publication number 20100314740
- Publication date Dec 16, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Keun-ho CHOI
- H01 - BASIC ELECTRIC ELEMENTS

Keun-Ho CHOI

Person

Patents Grantslast 30 patents

Bonding wire, semiconductor package including the same, and wire bo...

Semiconductor packages

Semiconductor packages

Bonding wire, semiconductor package including the same, and wire bo...

Semiconductor package

Semiconductor package and method for fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES

BONDING WIRE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND WIRE BO...

SEMICONDUCTOR PACKAGES

BONDING WIRE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND WIRE BO...

MULTI-CHIP PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE, STACK MODULE, CARD, AND ELECTRONIC SYSTEM