Keunho Jang

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Yongin-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Package frame and method of manufacturing semiconductor package usi...
- Patent number 10,147,616
- Issue date Dec 4, 2018
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230420355
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Eunkyul Oh
- H01 - BASIC ELECTRIC ELEMENTS