Keunhyuk LEE

Person

Suzhou, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Press-fit power module and related methods
- Patent number 12,119,576
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated 3D semiconductor device package with transistors attached...
- Patent number 12,074,160
- Issue date Aug 27, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible clip with aligner structure
- Patent number 11,908,826
- Issue date Feb 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with substrate recess for conductive-bonding component
- Patent number 11,776,871
- Issue date Oct 3, 2023
- Semiconductor Components Industries, LLC
- Leo Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual cool power module with stress buffer layer
- Patent number 11,658,171
- Issue date May 23, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and related methods
- Patent number 11,652,030
- Issue date May 16, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method of manufacturing the same
- Patent number 11,615,967
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe with sockets for solderless pins
- Patent number 11,315,856
- Issue date Apr 26, 2022
- Semiconductor Components Industries, LLC
- Tiburcio Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device package
- Patent number 11,222,832
- Issue date Jan 11, 2022
- Semiconductor Components Industries, LLC
- Tiburcio Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module semiconductor package with multiple submodules
- Patent number 11,127,651
- Issue date Sep 21, 2021
- Semiconductor Components Industries, LLC
- Jie Chang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power module package
- Patent number 11,004,698
- Issue date May 11, 2021
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit power module and related methods
- Patent number 10,804,626
- Issue date Oct 13, 2020
- Semiconductor Components Industries, LLC
- Jie Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe with sockets for solderless pins
- Patent number 10,741,480
- Issue date Aug 11, 2020
- Semiconductor Components Industries, LLC
- Tiburcio Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit power module and related methods
- Patent number 10,566,713
- Issue date Feb 18, 2020
- Semiconductor Components Industries, LLC
- Jie Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module semiconductor package with multiple submodules
- Patent number 10,553,517
- Issue date Feb 4, 2020
- Semiconductor Components Industries, LLC
- Jie Chang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
ISOLATED 3D SEMICONDUCTOR DEVICE PACKAGE WITH TRANSISTORS ATTACHED...
- Publication number 20240413148
- Publication date Dec 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tiburcio A. MALDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE DUAL PADS FOR A CIRCUIT
- Publication number 20240304529
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CLIP WITH ALIGNER STRUCTURE
- Publication number 20240194631
- Publication date Jun 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Keunhyuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE HAVING MIRRORED LEADS
- Publication number 20240128140
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES
- Publication number 20240088007
- Publication date Mar 14, 2024
- Semiconductor Components Industries, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT
- Publication number 20240030093
- Publication date Jan 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Leo GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240021487
- Publication date Jan 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CLIP
- Publication number 20230326902
- Publication date Oct 12, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL COOL POWER MODULE WITH STRESS BUFFER LAYER
- Publication number 20230253393
- Publication date Aug 10, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE DIRECT COOLING SEMICONDUCTOR PACKAGE
- Publication number 20230019930
- Publication date Jan 19, 2023
- Semiconductor Components Industries, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND RELATED METHODS
- Publication number 20220208654
- Publication date Jun 30, 2022
- Semiconductor Components Industries, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL COOL POWER MODULE WITH STRESS BUFFER LAYER
- Publication number 20220199602
- Publication date Jun 23, 2022
- Semiconductor Components Industries, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT
- Publication number 20220189848
- Publication date Jun 16, 2022
- Semiconductor Components Industries, LLC
- Leo GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED 3D SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20220020740
- Publication date Jan 20, 2022
- Semiconductor Components Industries, LLC
- Tiburcio A. MALDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME RELATED A...
- Publication number 20210265175
- Publication date Aug 26, 2021
- Semiconductor Components Industries, LLC
- Keunhyuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CLIP AND RELATED METHODS
- Publication number 20210159157
- Publication date May 27, 2021
- Semiconductor Components Industries, LLC
- Keunhyuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESS-FIT POWER MODULE AND RELATED METHODS
- Publication number 20210021065
- Publication date Jan 21, 2021
- Semiconductor Components Industries, LLC
- Jie CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH SOCKETS FOR SOLDERLESS PINS
- Publication number 20200365493
- Publication date Nov 19, 2020
- Semiconductor Components Industries, LLC
- Tiburcio MALDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200258824
- Publication date Aug 13, 2020
- Semiconductor Components Industries, LLC
- Tiburcio MALDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER MODULE SEMICONDUCTOR PACKAGE WITH MULTIPLE SUBMODULES
- Publication number 20200194336
- Publication date Jun 18, 2020
- Semiconductor Components Industries, LLC
- Jie Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESS-FIT POWER MODULE AND RELATED METHODS
- Publication number 20200144744
- Publication date May 7, 2020
- Semiconductor Components Industries, LLC
- Jie CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEADFRAME WITH SOCKETS FOR SOLDERLESS PINS
- Publication number 20190304883
- Publication date Oct 3, 2019
- Semiconductor Components Industries, LLC
- Tiburcio MALDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER MODULE SEMICONDUCTOR PACKAGE WITH MULTIPLE SUBMODULES
- Publication number 20190221493
- Publication date Jul 18, 2019
- Semiconductor Components Industries, LLC
- Jie CHANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PRESS-FIT POWER MODULE AND RELATED METHODS
- Publication number 20190214749
- Publication date Jul 11, 2019
- Semiconductor Components Industries, LLC
- Jie CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150103498
- Publication date Apr 16, 2015
- FAIRCHILD KOREA SEMICONDUCTOR LTD.
- Keunhyuk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Keunhyuk LEE

Person

Patents Grantslast 30 patents

Press-fit power module and related methods

Isolated 3D semiconductor device package with transistors attached...

Flexible clip with aligner structure

Module with substrate recess for conductive-bonding component

Dual cool power module with stress buffer layer

Power module and related methods

Power module package and method of manufacturing the same

Leadframe with sockets for solderless pins

Power semiconductor device package

High power module semiconductor package with multiple submodules

Power module package

Press-fit power module and related methods

Leadframe with sockets for solderless pins

Press-fit power module and related methods

High power module semiconductor package with multiple submodules

Patents Applicationslast 30 patents

ISOLATED 3D SEMICONDUCTOR DEVICE PACKAGE WITH TRANSISTORS ATTACHED...

DISCRETE DUAL PADS FOR A CIRCUIT

FLEXIBLE CLIP WITH ALIGNER STRUCTURE

POWER MODULE PACKAGE HAVING MIRRORED LEADS

POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES

MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT

SEMICONDUCTOR DEVICE PACKAGE

FLEXIBLE CLIP

DUAL COOL POWER MODULE WITH STRESS BUFFER LAYER

DUAL SIDE DIRECT COOLING SEMICONDUCTOR PACKAGE

POWER MODULE AND RELATED METHODS

DUAL COOL POWER MODULE WITH STRESS BUFFER LAYER

MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT

ISOLATED 3D SEMICONDUCTOR DEVICE PACKAGE

POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME RELATED A...

SEMICONDUCTOR CLIP AND RELATED METHODS

PRESS-FIT POWER MODULE AND RELATED METHODS

LEADFRAME WITH SOCKETS FOR SOLDERLESS PINS

POWER SEMICONDUCTOR DEVICE PACKAGE

HIGH POWER MODULE SEMICONDUCTOR PACKAGE WITH MULTIPLE SUBMODULES

PRESS-FIT POWER MODULE AND RELATED METHODS

LEADFRAME WITH SOCKETS FOR SOLDERLESS PINS

HIGH POWER MODULE SEMICONDUCTOR PACKAGE WITH MULTIPLE SUBMODULES

PRESS-FIT POWER MODULE AND RELATED METHODS

POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME