Kevin C. Douglas

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San Mateo, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Demountable tape-automated bonding method
- Patent number 5,276,961
- Issue date Jan 11, 1994
- Hewlett-Packard Company
- Farid Matta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tab frame with area array edge contacts
- Patent number 5,262,925
- Issue date Nov 16, 1993
- Hewlett-Packard Company
- Farid Matta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit demountable TAB apparatus
- Patent number 5,162,975
- Issue date Nov 10, 1992
- Hewlett-Packard Company
- Farid Matta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Demountable tape-automated bonding system
- Patent number 5,142,444
- Issue date Aug 25, 1992
- Hewlett-Packard Company
- Farid Matta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Demountable tape-automated bonding system
- Patent number 5,053,922
- Issue date Oct 1, 1991
- Hewlett-Packard Company
- Farid Matta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip alignment method
- Patent number 4,893,403
- Issue date Jan 16, 1990
- Hewlett-Packard Company
- Bruce Heflinger
- H01 - BASIC ELECTRIC ELEMENTS