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Hsinchu Hsien, TW
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Patents Grants
last 30 patents
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Patent Grant
Substrate structure for an image sensor package and method for manu...
Patent number
8,314,481
Issue date
Nov 20, 2012
Kingpak Technology Inc.
Chung Hsien Hsin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Injection molded image sensor and a method for manufacturing the same
Patent number
6,649,834
Issue date
Nov 18, 2003
Kingpak Technology Inc.
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Substrate structure for an image sensor package and method for manu...
Publication number
20060275943
Publication date
Dec 7, 2006
Chung Hsien Hsin
H01 - BASIC ELECTRIC ELEMENTS