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Taichung Hsien, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Quad flat non-leaded semiconductor package and method of fabricatin...
Patent number
6,703,691
Issue date
Mar 9, 2004
Siliconware Precision Industries Co., Ltd.
Nan-Jang Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having an exposed heat spreader
Patent number
6,552,428
Issue date
Apr 22, 2003
Siliconware Precision Industries Co., Ltd.
Chien Ping Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball grid array integrated circuit package structure
Patent number
6,359,341
Issue date
Mar 19, 2002
Siliconware Precision Industries, Co., Ltd.
Chien Ping Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having a heat sink with an exposed surface
Patent number
6,246,115
Issue date
Jun 12, 2001
Siliconware Precision Industries Co., Ltd.
Tom Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tiny ball grid array package
Patent number
6,218,731
Issue date
Apr 17, 2001
Siliconware Precision Industries Co., Ltd.
Chien-Ping Huang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Quad flat non-leaded semiconductor package and method of fabricatin...
Publication number
20030042583
Publication date
Mar 6, 2003
Siliconware Precision Industries Co., Ltd.
Nan-Jang Chen
H01 - BASIC ELECTRIC ELEMENTS