Kevin Formosa

Person

Zabbar, MT

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing electronic devices and corresponding electr...
- Patent number 12,017,910
- Issue date Jun 25, 2024
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing electronic devices and corresponding electr...
- Patent number 11,524,892
- Issue date Dec 13, 2022
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and corresponding manufacturing method
- Patent number 11,352,251
- Issue date Jun 7, 2022
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package with chambers for dies and manufacturing process thereof
- Patent number 10,329,143
- Issue date Jun 25, 2019
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical microphone
- Patent number 10,225,635
- Issue date Mar 5, 2019
- STMicroelectronics S.r.l.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level packaging of integrated devices, and manufacturing meth...
- Patent number 9,446,943
- Issue date Sep 20, 2016
- STMicroelectronics S.r.l.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for soldering a cap to a support layer
- Patent number 9,390,988
- Issue date Jul 12, 2016
- STMicroelectronics (Malta) Ltd.
- Mark A. Azzopardi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Surface mount package for a semiconductor integrated device, relate...
- Patent number 9,257,372
- Issue date Feb 9, 2016
- STMicroelectronics (Mala) Ltd
- Roseanne Duca
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package for a MEMS sensor and manufacturing process thereof
- Patent number 9,253,579
- Issue date Feb 2, 2016
- STMicroelectronics Ltd (Malta)
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical transducer and corresponding assembly process
- Patent number 8,837,754
- Issue date Sep 16, 2014
- STMicroelectronics S.r.l.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Removable wafer expander for die bonding equipment
- Patent number 7,675,170
- Issue date Mar 9, 2010
- STMicroelectronics Ltd
- Kevin Formosa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTR...
- Publication number 20230110259
- Publication date Apr 13, 2023
- STMicroelectronics (Malta) Ltd.
- Kevin FORMOSA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE AND CORRESPONDING MANUFACTURING METHOD
- Publication number 20200307991
- Publication date Oct 1, 2020
- STMicroelectronics (Malta) Ltd.
- Kevin FORMOSA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTR...
- Publication number 20200307994
- Publication date Oct 1, 2020
- STMicroelectronics (Malta) Ltd.
- Kevin FORMOSA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL MICROPHONE
- Publication number 20170006368
- Publication date Jan 5, 2017
- STMicroelectronics S.r.l.
- Roberto BRIOSCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENTS AND CORRESPONDING ELE...
- Publication number 20160368098
- Publication date Dec 22, 2016
- STMicroelectronics (Malta) Ltd.
- Kenneth Fonk
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE FOR A MEMS SENSOR AND MANUFACTURING PROCESS THEREOF
- Publication number 20160107884
- Publication date Apr 21, 2016
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-LEVEL PACKAGING OF INTEGRATED DEVICES, AND MANUFACTURING METH...
- Publication number 20140353775
- Publication date Dec 4, 2014
- STMicroelectronics S.r.l.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SURFACE MOUNT PACKAGE FOR A SEMICONDUCTOR INTEGRATED DEVICE, RELATE...
- Publication number 20140091443
- Publication date Apr 3, 2014
- STMicroelectronics Pte Ltd
- Roseanne Duca
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR SOLDERING A CAP TO A SUPPORT LAYER
- Publication number 20130083501
- Publication date Apr 4, 2013
- STMICROELECTRONICS LTD (MALTA)
- Mark A. Azzopardi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE FOR A MEMS SENSOR AND MANUFACTURING PROCESS THEREOF
- Publication number 20130032936
- Publication date Feb 7, 2013
- STMICROELECTRONICS LTD (MALTA)
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL TRANSDUCER AND CORRESPONDING ASSEMBLY PROCESS
- Publication number 20120153771
- Publication date Jun 21, 2012
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REMOVABLE WAFER EXPANDER FOR DIE BONDING EQUIPMENT
- Publication number 20080032489
- Publication date Feb 7, 2008
- STMICROELECTRONICS LTD.
- Kevin Formosa
- H01 - BASIC ELECTRIC ELEMENTS

Kevin Formosa

Person

Patents Grantslast 30 patents

Method of manufacturing electronic devices and corresponding electr...

Method of manufacturing electronic devices and corresponding electr...

Electronic device and corresponding manufacturing method

Package with chambers for dies and manufacturing process thereof

Microelectromechanical microphone

Wafer-level packaging of integrated devices, and manufacturing meth...

Method for soldering a cap to a support layer

Surface mount package for a semiconductor integrated device, relate...

Package for a MEMS sensor and manufacturing process thereof

Microelectromechanical transducer and corresponding assembly process

Removable wafer expander for die bonding equipment

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTR...

ELECTRONIC DEVICE AND CORRESPONDING MANUFACTURING METHOD

METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTR...

MICROELECTROMECHANICAL MICROPHONE

METHOD OF MANUFACTURING ELECTRONIC COMPONENTS AND CORRESPONDING ELE...

PACKAGE FOR A MEMS SENSOR AND MANUFACTURING PROCESS THEREOF

WAFER-LEVEL PACKAGING OF INTEGRATED DEVICES, AND MANUFACTURING METH...

SURFACE MOUNT PACKAGE FOR A SEMICONDUCTOR INTEGRATED DEVICE, RELATE...

METHOD FOR SOLDERING A CAP TO A SUPPORT LAYER

PACKAGE FOR A MEMS SENSOR AND MANUFACTURING PROCESS THEREOF

MICROELECTROMECHANICAL TRANSDUCER AND CORRESPONDING ASSEMBLY PROCESS

REMOVABLE WAFER EXPANDER FOR DIE BONDING EQUIPMENT