Kevin Guan

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Richmond, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method and system for thin multi chip stack package with film on wi...
- Patent number 8,680,686
- Issue date Mar 25, 2014
- Spansion LLC
- Lai Nguk Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stitch bump stacking design for overall package size reduction for...
- Patent number 8,357,563
- Issue date Jan 22, 2013
- Spansion LLC
- Lai Nguk Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of package height in a stacked die configuration
- Patent number 7,932,131
- Issue date Apr 26, 2011
- Spansion LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die offset die to die bonding
- Patent number 7,750,481
- Issue date Jul 6, 2010
- Spansion LLC
- Nguk Chin Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die offset die to bonding
- Patent number 7,674,653
- Issue date Mar 9, 2010
- Spansion LLC
- Nguk Chin Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die offset die to die bonding
- Patent number 7,554,204
- Issue date Jun 30, 2009
- Spansion LLC
- Nguk Chin Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STITCH BUMP STACKING DESIGN FOR OVERALL PACKAGE SIZE REDUCTION FOR...
- Publication number 20120038059
- Publication date Feb 16, 2012
- Lai Nguk CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR THIN MULTI CHIP STACK PACKAGE WITH FILM ON WI...
- Publication number 20110316158
- Publication date Dec 29, 2011
- Lai Nguk CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduction of package height in a stacked die configuration
- Publication number 20090115033
- Publication date May 7, 2009
- Spansion LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die offset die to die bonding
- Publication number 20090091043
- Publication date Apr 9, 2009
- Nguk Chin Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die offset die to bonding
- Publication number 20090093084
- Publication date Apr 9, 2009
- Nguk Chin Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die offset die to die bonding
- Publication number 20080308947
- Publication date Dec 18, 2008
- Spansion LLC
- Nguk Chin Lai
- H01 - BASIC ELECTRIC ELEMENTS