Kevin Haley

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Diamond heat spreading and cooling technique for integrated circuits
- Patent number 7,132,313
- Issue date Nov 7, 2006
- Intel Corporation
- Michael O'Connor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diamond heat spreading and cooling technique for integrated circuits
- Patent number 6,667,548
- Issue date Dec 23, 2003
- Intel Corporation
- Michael O'Connor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socketable BGA package
- Patent number 6,404,047
- Issue date Jun 11, 2002
- Intel Corporation
- Kevin J. Haley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal connector for joining mobile electronic devices to docking...
- Patent number 6,313,987
- Issue date Nov 6, 2001
- Intel Corporation
- Michael O'Connor
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling system for integrated circuit chips in a portable computer
- Patent number 6,181,555
- Issue date Jan 30, 2001
- Intel Corporation
- Kevin Haley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Socketable BGA package
- Patent number 6,168,976
- Issue date Jan 2, 2001
- Intel Corporation
- Kevin J. Haley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface thickness control for a microprocessor
- Patent number 6,043,560
- Issue date Mar 28, 2000
- Intel Corporation
- Kevin J. Haley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling system for integrated circuit chips in a portable computer...
- Patent number 5,982,617
- Issue date Nov 9, 1999
- Intel Corporation
- Kevin Haley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling system for thin profile electronic and computer devices
- Patent number 5,966,286
- Issue date Oct 12, 1999
- Intel Corporation
- Michael O'Connor
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Injection molded thermal interface system
- Patent number 5,956,229
- Issue date Sep 21, 1999
- Intel Corporation
- Michael Brownell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat pipe exchanger system for cooling a hinged computing device
- Patent number 5,718,282
- Issue date Feb 17, 1998
- Intel Corporation
- Rakesh Bhatia
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat pipe exchanger system for cooling a hinged computing device
- Patent number 5,646,822
- Issue date Jul 8, 1997
- Intel Corporation
- Rakesh Bhatia
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Apparatus for dissipating heat in a hinged computing device
- Patent number 5,621,613
- Issue date Apr 15, 1997
- Intel Corporation
- Kevin Haley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of making solder shape array package
- Patent number 5,531,021
- Issue date Jul 2, 1996
- Intel Corporation
- Frank Kolman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape BGA package die-up/die down
- Patent number 5,506,756
- Issue date Apr 9, 1996
- Intel Corporation
- Kevin Haley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting very small integrated circuit package on PCB
- Patent number 5,359,768
- Issue date Nov 1, 1994
- Intel Corporation
- Kevin J. Haley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin, high leadcount package
- Patent number 5,359,225
- Issue date Oct 25, 1994
- Intel Corporation
- Kevin J. Haley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin, high leadcount package
- Patent number 5,290,735
- Issue date Mar 1, 1994
- Intel Corporation
- Kevin J. Haley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for surface mounting an integrated circuit package
- Patent number 5,006,962
- Issue date Apr 9, 1991
- Intel Corporation
- Kevin Haley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Diamond heat spreading and cooling technique for integrated circuits
- Publication number 20040104014
- Publication date Jun 3, 2004
- Intel Corporation
- Michael O'Connor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diamond heat spreading and cooling technique for integrated circuits
- Publication number 20020145194
- Publication date Oct 10, 2002
- Intel Corporation
- Michael O'Connor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONNECTOR FOR JOINING MOBILE ELECTRONIC DEVICES TO DOCKING...
- Publication number 20010040788
- Publication date Nov 15, 2001
- MICHAEL O'CONNOR
- G06 - COMPUTING CALCULATING COUNTING

Kevin Haley

Person

Patents Grantslast 30 patents

Diamond heat spreading and cooling technique for integrated circuits

Diamond heat spreading and cooling technique for integrated circuits

Socketable BGA package

Thermal connector for joining mobile electronic devices to docking...

Cooling system for integrated circuit chips in a portable computer

Socketable BGA package

Thermal interface thickness control for a microprocessor

Cooling system for integrated circuit chips in a portable computer...

Cooling system for thin profile electronic and computer devices

Injection molded thermal interface system

Heat pipe exchanger system for cooling a hinged computing device

Heat pipe exchanger system for cooling a hinged computing device

Apparatus for dissipating heat in a hinged computing device

Method of making solder shape array package

Tape BGA package die-up/die down

Method for mounting very small integrated circuit package on PCB

Thin, high leadcount package

Thin, high leadcount package

Apparatus for surface mounting an integrated circuit package

Patents Applicationslast 30 patents

Diamond heat spreading and cooling technique for integrated circuits

Diamond heat spreading and cooling technique for integrated circuits

THERMAL CONNECTOR FOR JOINING MOBILE ELECTRONIC DEVICES TO DOCKING...