Kevin J. Anderson

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for packaging an integrated circuit (IC) package with embedd...
- Patent number 11,929,300
- Issue date Mar 12, 2024
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package with embedded heat spreader in a re...
- Patent number 11,626,340
- Issue date Apr 11, 2023
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate-based package with internal overmold
- Patent number 10,390,434
- Issue date Aug 20, 2019
- Qorvo US, Inc.
- Kevin J. Anderson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Air-cavity package with enhanced package integration level and ther...
- Patent number 10,217,686
- Issue date Feb 26, 2019
- Qorvo US, Inc.
- Walid M. Meliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-cavity package with dual signal-transition sides
- Patent number 10,217,685
- Issue date Feb 26, 2019
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air cavity package
- Patent number 10,177,064
- Issue date Jan 8, 2019
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-cavity package with enhanced package integration level and ther...
- Patent number 9,991,181
- Issue date Jun 5, 2018
- Qorvo US, Inc.
- Walid M. Meliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-cavity package with two heat dissipation interfaces
- Patent number 9,974,158
- Issue date May 15, 2018
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-cavity package with dual signal-transition sides
- Patent number 9,935,026
- Issue date Apr 3, 2018
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with lid having lid conductive structure
- Patent number 9,799,637
- Issue date Oct 24, 2017
- Qorvo US, Inc.
- Brian P. Balut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow-cavity flip-chip package with reinforced interconnects and p...
- Patent number 9,793,237
- Issue date Oct 17, 2017
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses, systems, and methods for die attach coatings for semic...
- Patent number 9,659,898
- Issue date May 23, 2017
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single balanced self-oscillating dual gate FET mixer
- Patent number 4,658,440
- Issue date Apr 14, 1987
- Texas Instruments Incorporated
- Anthony M. Pavio
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...
- Publication number 20230207415
- Publication date Jun 29, 2023
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METALLIZATION FOR SEMICONDUCTOR ASSEMBLY
- Publication number 20230178486
- Publication date Jun 8, 2023
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...
- Publication number 20210183722
- Publication date Jun 17, 2021
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE-BASED PACKAGE WITH INTERNAL OVERMOLD
- Publication number 20190116670
- Publication date Apr 18, 2019
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-CAVITY PACKAGE WITH ENHANCED PACKAGE INTEGRATION LEVEL AND THER...
- Publication number 20180218955
- Publication date Aug 2, 2018
- Qorvo US, Inc.
- Walid M. Meliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-CAVITY PACKAGE WITH DUAL SIGNAL-TRANSITION SIDES
- Publication number 20180197800
- Publication date Jul 12, 2018
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-CAVITY PACKAGE WITH TWO HEAT DISSIPATION INTERFACES
- Publication number 20180063940
- Publication date Mar 1, 2018
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-CAVITY PACKAGE WITH ENHANCED PACKAGE INTEGRATION LEVEL AND THER...
- Publication number 20180061725
- Publication date Mar 1, 2018
- Qorvo US, Inc.
- Walid M. Meliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR CAVITY PACKAGE
- Publication number 20180061730
- Publication date Mar 1, 2018
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-CAVITY PACKAGE WITH DUAL SIGNAL-TRANSITION SIDES
- Publication number 20180061726
- Publication date Mar 1, 2018
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH LID HAVING LID CONDUCTIVE STRUCTURE
- Publication number 20170236808
- Publication date Aug 17, 2017
- Qorvo US, Inc.
- Brian P. Balut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLLOW-CAVITY FLIP-CHIP PACKAGE WITH REINFORCED INTERCONNECTS AND P...
- Publication number 20170110434
- Publication date Apr 20, 2017
- TriQuint Semiconductor, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS

Kevin J. Anderson

Person

Patents Grantslast 30 patents

Method for packaging an integrated circuit (IC) package with embedd...

Integrated circuit (IC) package with embedded heat spreader in a re...

Laminate-based package with internal overmold

Air-cavity package with enhanced package integration level and ther...

Air-cavity package with dual signal-transition sides

Air cavity package

Air-cavity package with enhanced package integration level and ther...

Air-cavity package with two heat dissipation interfaces

Air-cavity package with dual signal-transition sides

Semiconductor package with lid having lid conductive structure

Hollow-cavity flip-chip package with reinforced interconnects and p...

Apparatuses, systems, and methods for die attach coatings for semic...

Single balanced self-oscillating dual gate FET mixer

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...

BACKSIDE METALLIZATION FOR SEMICONDUCTOR ASSEMBLY

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...

LAMINATE-BASED PACKAGE WITH INTERNAL OVERMOLD

AIR-CAVITY PACKAGE WITH ENHANCED PACKAGE INTEGRATION LEVEL AND THER...

AIR-CAVITY PACKAGE WITH DUAL SIGNAL-TRANSITION SIDES

AIR-CAVITY PACKAGE WITH TWO HEAT DISSIPATION INTERFACES

AIR-CAVITY PACKAGE WITH ENHANCED PACKAGE INTEGRATION LEVEL AND THER...

AIR CAVITY PACKAGE

AIR-CAVITY PACKAGE WITH DUAL SIGNAL-TRANSITION SIDES

SEMICONDUCTOR PACKAGE WITH LID HAVING LID CONDUCTIVE STRUCTURE

HOLLOW-CAVITY FLIP-CHIP PACKAGE WITH REINFORCED INTERCONNECTS AND P...