Kevin J. Bills

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Coreless multi-layer circuit substrate with minimized pad capacitance
- Patent number 9,773,725
- Issue date Sep 26, 2017
- International Business Machines Corporation
- Kevin Bills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced wiring requirements with signal slope manipulation
- Patent number 9,548,769
- Issue date Jan 17, 2017
- International Business Machines Corporation
- Kevin J. Bills
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Coreless multi-layer circuit substrate with minimized pad capacitance
- Patent number 9,060,428
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Kevin Bills
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Corles multi-layer circuit substrate with minimized pad capacitance
- Patent number 8,975,525
- Issue date Mar 10, 2015
- International Business Machines Corporation
- Kevin Bills
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reduced wiring requirements with signal slope manipulation
- Patent number 8,743,558
- Issue date Jun 3, 2014
- International Business Machines Corporation
- Kevin J. Bills
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Testing an optical fiber connection
- Patent number 8,593,621
- Issue date Nov 26, 2013
- International Business Machines Corporation
- Kevin J. Bills
- G01 - MEASURING TESTING
Information Patent Grant
Coreless multi-layer circuit substrate with minimized pad capacitance
- Patent number 8,389,870
- Issue date Mar 5, 2013
- International Business Machines Corporation
- Kevin Bills
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reduced wiring requirements with signal slope manipulation
- Patent number 8,358,509
- Issue date Jan 22, 2013
- International Business Machines Corporation
- Kevin J. Bills
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE
- Publication number 20160225705
- Publication date Aug 4, 2016
- International Business Machines Corporation
- Kevin Bills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduced Wiring Requirements With Signal Slope Manipulation
- Publication number 20140226749
- Publication date Aug 14, 2014
- International Business Machines Corporation
- Kevin J. Bills
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
REDUCED WIRING REQUIREMENTS WITH SIGNAL SLOPE MANIPULATION
- Publication number 20130010445
- Publication date Jan 10, 2013
- International Business Machines Corporation
- Kevin J. Bills
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CORLES MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE
- Publication number 20130008696
- Publication date Jan 10, 2013
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- Kevin Bills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE
- Publication number 20130003335
- Publication date Jan 3, 2013
- International Business Machines Corporation
- Kevin Bills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Testing An Optical Fiber Connection
- Publication number 20110267602
- Publication date Nov 3, 2011
- International Business Machines Corporation
- Kevin J. Bills
- G01 - MEASURING TESTING
Information Patent Application
CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE
- Publication number 20110222224
- Publication date Sep 15, 2011
- International Business Machines Corporation
- Kevin Bills
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED WIRING REQUIREMENTS WITH SIGNAL SLOPE MANIPULATION
- Publication number 20100195756
- Publication date Aug 5, 2010
- International Business Machines Corporation
- Kevin J. Bills
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Kevin J. Bills

Person

Patents Grantslast 30 patents

Coreless multi-layer circuit substrate with minimized pad capacitance

Reduced wiring requirements with signal slope manipulation

Coreless multi-layer circuit substrate with minimized pad capacitance

Corles multi-layer circuit substrate with minimized pad capacitance

Reduced wiring requirements with signal slope manipulation

Testing an optical fiber connection

Coreless multi-layer circuit substrate with minimized pad capacitance

Reduced wiring requirements with signal slope manipulation

Patents Applicationslast 30 patents

CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE

Reduced Wiring Requirements With Signal Slope Manipulation

REDUCED WIRING REQUIREMENTS WITH SIGNAL SLOPE MANIPULATION

CORLES MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE

CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE

Testing An Optical Fiber Connection

CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE

REDUCED WIRING REQUIREMENTS WITH SIGNAL SLOPE MANIPULATION