Kevin J. Lally

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Real-time parameter tuning for etch processes
- Patent number 7,801,635
- Issue date Sep 21, 2010
- Tokyo Electron Limited
- Merritt Funk
- G05 - CONTROLLING REGULATING
Information Patent Grant
Real-time parameter tuning using wafer thickness
- Patent number 7,642,102
- Issue date Jan 5, 2010
- Tokyo Electron Limited
- Merritt Funk
- G01 - MEASURING TESTING
Information Patent Grant
Damage assessment of a wafer using optical metrology
- Patent number 7,623,978
- Issue date Nov 24, 2009
- Tokyo Electron Limited
- Kevin Lally
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring a damaged structure formed on a wafer using optical metro...
- Patent number 7,619,731
- Issue date Nov 17, 2009
- Tokyo Electron Limited
- Kevin Lally
- G01 - MEASURING TESTING
Information Patent Grant
Creating a library for measuring a damaged structure formed on a wa...
- Patent number 7,576,851
- Issue date Aug 18, 2009
- Tokyo Electron Limited
- Kevin Lally
- G01 - MEASURING TESTING
Information Patent Grant
Method of using a wafer-thickness-dependant profile library
- Patent number 7,571,074
- Issue date Aug 4, 2009
- Tokyo Electron Limited
- Merritt Funk
- G01 - MEASURING TESTING
Information Patent Grant
Feature dimension deviation correction system, method and program p...
- Patent number 7,502,660
- Issue date Mar 10, 2009
- International Business Machines Corporation
- David V. Horak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fault detection and classification (FDC) using a run-to-run controller
- Patent number 7,477,960
- Issue date Jan 13, 2009
- Tokyo Electron Limited
- James E. Willis
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Measuring a damaged structure formed on a wafer using optical metro...
- Patent number 7,324,193
- Issue date Jan 29, 2008
- Tokyo Electron Limited
- Kevin Lally
- G01 - MEASURING TESTING
Information Patent Grant
Feature dimension deviation correction system, method and program p...
- Patent number 7,289,864
- Issue date Oct 30, 2007
- International Business Machines Corporation
- David V. Horak
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Real-Time Parameter Tuning For Etch Processes
- Publication number 20080183312
- Publication date Jul 31, 2008
- TOKYO ELECTRON LIMITED
- Merritt Funk
- G05 - CONTROLLING REGULATING
Information Patent Application
Method of Using a Wafer-Thickness-Dependant Profile Library
- Publication number 20080183411
- Publication date Jul 31, 2008
- TOKYO ELECTRON LIMITED
- Merritt Funk
- G01 - MEASURING TESTING
Information Patent Application
Real-Time Parameter Tuning Using Wafer Thickness
- Publication number 20080183412
- Publication date Jul 31, 2008
- TOKYO ELECTRON LIMITED
- Merritt Funk
- G01 - MEASURING TESTING
Information Patent Application
MEASURING A DAMAGED STRUCTURE FORMED ON A WAFER USING OPTICAL METRO...
- Publication number 20080137078
- Publication date Jun 12, 2008
- TOKYO ELECTRON LIMITED
- Kevin LALLY
- G01 - MEASURING TESTING
Information Patent Application
FEATURE DIMENSION DEVIATION CORRECTION SYSTEM, METHOD AND PROGRAM P...
- Publication number 20080027577
- Publication date Jan 31, 2008
- David V. Horak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Damage assessment of a wafer using optical metrology
- Publication number 20070232045
- Publication date Oct 4, 2007
- Tokyo Electron, Ltd.
- Kevin Lally
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Creating a library for measuring a damaged structure formed on a wa...
- Publication number 20070233404
- Publication date Oct 4, 2007
- Tokyo Electron, Ltd.
- Kevin Lally
- G01 - MEASURING TESTING
Information Patent Application
Measuring a damaged structure formed on a wafer using optical metro...
- Publication number 20070229807
- Publication date Oct 4, 2007
- Tokyo Electron, Ltd.
- Kevin Lally
- G01 - MEASURING TESTING
Information Patent Application
Measuring a damaged structure formed on a wafer using optical metro...
- Publication number 20070229806
- Publication date Oct 4, 2007
- Tokyo Electron, Ltd.
- Kevin Lally
- G01 - MEASURING TESTING
Information Patent Application
Fault detection and classification (FDC) using a run-to-run controller
- Publication number 20060184264
- Publication date Aug 17, 2006
- TOKYO ELECTRON LIMITED
- James E. Willis
- G05 - CONTROLLING REGULATING
Information Patent Application
FEATURE DIMENSION DEVIATION CORRECTION SYSTEM, METHOD AND PROGRAM P...
- Publication number 20060007453
- Publication date Jan 12, 2006
- International Business Machines Corporation
- David V. Horak
- H01 - BASIC ELECTRIC ELEMENTS

Kevin J. Lally

Person

Patents Grantslast 30 patents

Real-time parameter tuning for etch processes

Real-time parameter tuning using wafer thickness

Damage assessment of a wafer using optical metrology

Measuring a damaged structure formed on a wafer using optical metro...

Creating a library for measuring a damaged structure formed on a wa...

Method of using a wafer-thickness-dependant profile library

Feature dimension deviation correction system, method and program p...

Fault detection and classification (FDC) using a run-to-run controller

Measuring a damaged structure formed on a wafer using optical metro...

Feature dimension deviation correction system, method and program p...

Patents Applicationslast 30 patents

Real-Time Parameter Tuning For Etch Processes

Method of Using a Wafer-Thickness-Dependant Profile Library

Real-Time Parameter Tuning Using Wafer Thickness

MEASURING A DAMAGED STRUCTURE FORMED ON A WAFER USING OPTICAL METRO...

FEATURE DIMENSION DEVIATION CORRECTION SYSTEM, METHOD AND PROGRAM P...

Damage assessment of a wafer using optical metrology

Creating a library for measuring a damaged structure formed on a wa...

Measuring a damaged structure formed on a wafer using optical metro...

Measuring a damaged structure formed on a wafer using optical metro...

Fault detection and classification (FDC) using a run-to-run controller

FEATURE DIMENSION DEVIATION CORRECTION SYSTEM, METHOD AND PROGRAM P...