Kevin Jeng

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Cupertino, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Ball-limiting metallurgies, solder bump compositions used therewith...
- Patent number 7,960,831
- Issue date Jun 14, 2011
- Intel Corporation
- Fay Hua
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Ball-limiting metallurgies, solder bump compositions used therewith...
- Patent number 7,314,819
- Issue date Jan 1, 2008
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a cap above a metal layer
- Patent number 7,056,817
- Issue date Jun 6, 2006
- Intel Corporation
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding surface and bonding method
- Patent number 6,265,300
- Issue date Jul 24, 2001
- Intel Corporation
- Ameet S. Bhansali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure having an interposed rigid layer
- Patent number 5,567,981
- Issue date Oct 22, 1996
- Intel Corporation
- Ameet S. Bhansali
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BALL-LIMITING METALLURGIES, SOLDER BUMP COMPOSITIONS USED THEREWITH...
- Publication number 20070284741
- Publication date Dec 13, 2007
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball-limiting metallurgies, solder bump compositions used therewith...
- Publication number 20070004086
- Publication date Jan 4, 2007
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming a cap above a metal layer
- Publication number 20060180945
- Publication date Aug 17, 2006
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming a cap above a metal layer
- Publication number 20040094836
- Publication date May 20, 2004
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS