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Kevin Jin
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Hsin-Tien City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Mixing apparatus for mixing bonding adhesive at die bonder before d...
Patent number
9,272,302
Issue date
Mar 1, 2016
Texas Instruments Incorporated
Frank Yu
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Grant
Mixing bonding adhesive at die bonder before dispense
Patent number
8,668,794
Issue date
Mar 11, 2014
Texas Instruments Incorporated
Frank Yu
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Grant
Semiconductor chip package assembly method and apparatus for counte...
Patent number
8,008,131
Issue date
Aug 30, 2011
Texas Instruments Incorporated
Chien-Te Feng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for flip chip device assembly by radiant heating
Patent number
7,056,767
Issue date
Jun 6, 2006
Texas Instruments Incorporated
Jimmy Liang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Mixing Apparatus for Mixing Bonding Adhesive at Die Bonder Before D...
Publication number
20130298827
Publication date
Nov 14, 2013
TEXAS INSTRUMENTS INCORPORATED
Frank Yu
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
MIXING BONDING ADHESIVE AT DIE BONDER BEFORE DISPENSE
Publication number
20120199285
Publication date
Aug 9, 2012
TEXAS INSTRUMENTS INCORPORATED
Frank Yu
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Semiconductor Chip Package Assembly Method and Apparatus for Counte...
Publication number
20090243057
Publication date
Oct 1, 2009
Chien-Te Feng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods and apparatus to dispense adhesive for semiconductor packaging
Publication number
20080073028
Publication date
Mar 27, 2008
Frank Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and apparatus for flip chip device assembly by radiant heating
Publication number
20040108600
Publication date
Jun 10, 2004
Jimmy Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and apparatus for flip chip device assembly by radiant heating
Publication number
20030132528
Publication date
Jul 17, 2003
Jimmy Liang
H01 - BASIC ELECTRIC ELEMENTS