Kevin Kunzhong Hu

Person

Irvine, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal enhanced package using embedded substrate
- Patent number 9,564,391
- Issue date Feb 7, 2017
- Broadcom Corporation
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interposer having a cavity for intra-interposer die
- Patent number 9,548,251
- Issue date Jan 17, 2017
- Broadcom Corporation
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a bridge interposer
- Patent number 9,431,371
- Issue date Aug 30, 2016
- Broadcom Corporation
- Sampath K. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked packaging using reconstituted wafers
- Patent number 9,293,393
- Issue date Mar 22, 2016
- Broadcom Corporation
- Kevin Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with integrated socket
- Patent number 9,275,976
- Issue date Mar 1, 2016
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved testability
- Patent number 9,153,507
- Issue date Oct 6, 2015
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a bridge interposer
- Patent number 9,059,179
- Issue date Jun 16, 2015
- Broadcom Corporation
- Sampath K. V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable interposer with conductive particles
- Patent number 9,041,171
- Issue date May 26, 2015
- Broadcom Corporation
- Sam Ziqun Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with ultra-thin interposer without through-se...
- Patent number 9,013,041
- Issue date Apr 21, 2015
- Broadcom Corporation
- Sampath K. V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating a wafer level semiconductor package having a pre-formed...
- Patent number 8,945,991
- Issue date Feb 3, 2015
- Broadcom Corporation
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated electromagnetic shielding
- Patent number 8,928,128
- Issue date Jan 6, 2015
- Broadcom Corporation
- Sampath K. V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level semiconductor package
- Patent number 8,922,014
- Issue date Dec 30, 2014
- Broadcom Corporation
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with integrated heat spreaders
- Patent number 8,872,321
- Issue date Oct 28, 2014
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an interposer configured for magnetic...
- Patent number 8,791,533
- Issue date Jul 29, 2014
- Broadcom Corporation
- Xiangdong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated selectively conductive film i...
- Patent number 8,749,072
- Issue date Jun 10, 2014
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a wafer level semiconductor package having a...
- Patent number 8,592,259
- Issue date Nov 26, 2013
- Broadcom Corporation
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip and multi-substrate reconstitution based packaging
- Patent number 8,587,123
- Issue date Nov 19, 2013
- Broadcom Corporation
- Edward Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device module with flip chip devices on a common lead...
- Patent number 7,301,235
- Issue date Nov 27, 2007
- International Rectifier Corporation
- Christopher P. Schaffer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED PACKAGING USING RECONSTITUTED WAFERS
- Publication number 20160155728
- Publication date Jun 2, 2016
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A BRIDGE INTERPOSER
- Publication number 20150235992
- Publication date Aug 20, 2015
- BROADCOM CORPORATION
- Sampath K. KARIKALAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGING USING RECONSTITUTED WAFERS
- Publication number 20140151900
- Publication date Jun 5, 2014
- BROADCOM CORPORATION
- Kevin Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Semiconductor Package
- Publication number 20140084462
- Publication date Mar 27, 2014
- BROADCOM CORPORATION
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabricating a Wafer Level Semiconductor Package Having a Pre-formed...
- Publication number 20140087553
- Publication date Mar 27, 2014
- BROADCOM CORPORATION
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Integrated Electromagnetic Shielding
- Publication number 20130221499
- Publication date Aug 29, 2013
- BROADCOM CORPORATION
- Sampath K.V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System-In-Package with Integrated Socket
- Publication number 20130221500
- Publication date Aug 29, 2013
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Integrated Selectively Conductive Film I...
- Publication number 20130221525
- Publication date Aug 29, 2013
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages with Integrated Heat Spreaders
- Publication number 20130221506
- Publication date Aug 29, 2013
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Improved Testability
- Publication number 20130193996
- Publication date Aug 1, 2013
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having an Interposer Configured for Magnetic...
- Publication number 20130193587
- Publication date Aug 1, 2013
- BROADCOM CORPORATION
- Xiangdong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Interposer Having a Cavity for Intra-Interposer Die
- Publication number 20130181354
- Publication date Jul 18, 2013
- BROADCOM CORPORATION
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Ultra-Thin Interposer Without Through-Se...
- Publication number 20130168860
- Publication date Jul 4, 2013
- BROADCOM CORPORATION
- Sampath K.V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with a Bridge Interposer
- Publication number 20130168854
- Publication date Jul 4, 2013
- BROADCOM CORPORATION
- Sampath K.V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Programmable Interposer with Conductive Particles
- Publication number 20130168841
- Publication date Jul 4, 2013
- BROADCOM CORPORATION (IRVINE, CA)
- Sam Ziqun Zhao
- B82 - NANO-TECHNOLOGY
Information Patent Application
Stacked Packaging Using Reconstituted Wafers
- Publication number 20130154106
- Publication date Jun 20, 2013
- BROADCOM CORPORATION
- Kevin Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Semiconductor Package
- Publication number 20130134596
- Publication date May 30, 2013
- BROADCOM CORPORATION
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip and Multi-Substrate Reconstitution Based Packaging
- Publication number 20130075917
- Publication date Mar 28, 2013
- BROADCOM CORPORATION
- Edward LAW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Enhanced Package Using Embedded Substrate
- Publication number 20120175773
- Publication date Jul 12, 2012
- BROADCOM CORPORATION
- Kevin (Kunzhong) HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gas burner with thermoelectric generator
- Publication number 20060172245
- Publication date Aug 3, 2006
- Caroline K. Hu
- F23 - COMBUSTION APPARATUS COMBUSTION PROCESSES
Information Patent Application
Gas stove with thermoelectric generator
- Publication number 20060016446
- Publication date Jan 26, 2006
- Caroline K. Hu
- F24 - HEATING RANGES VENTILATING
Information Patent Application
Semiconductor device module with flip chip devices on a common lead...
- Publication number 20050280163
- Publication date Dec 22, 2005
- International Rectifier Corp.
- Christopher P. Schaffer
- H01 - BASIC ELECTRIC ELEMENTS

Kevin Kunzhong Hu

Person

Patents Grantslast 30 patents

Thermal enhanced package using embedded substrate

Semiconductor interposer having a cavity for intra-interposer die

Semiconductor package with a bridge interposer

Stacked packaging using reconstituted wafers

System-in-package with integrated socket

Semiconductor package with improved testability

Semiconductor package with a bridge interposer

Programmable interposer with conductive particles

Semiconductor package with ultra-thin interposer without through-se...

Fabricating a wafer level semiconductor package having a pre-formed...

Semiconductor package with integrated electromagnetic shielding

Wafer level semiconductor package

Semiconductor packages with integrated heat spreaders

Semiconductor package having an interposer configured for magnetic...

Semiconductor package with integrated selectively conductive film i...

Method of fabricating a wafer level semiconductor package having a...

Multi-chip and multi-substrate reconstitution based packaging

Semiconductor device module with flip chip devices on a common lead...

Patents Applicationslast 30 patents

STACKED PACKAGING USING RECONSTITUTED WAFERS

SEMICONDUCTOR PACKAGE WITH A BRIDGE INTERPOSER

STACKED PACKAGING USING RECONSTITUTED WAFERS

Wafer Level Semiconductor Package

Fabricating a Wafer Level Semiconductor Package Having a Pre-formed...

Semiconductor Package with Integrated Electromagnetic Shielding

System-In-Package with Integrated Socket

Semiconductor Package with Integrated Selectively Conductive Film I...

Semiconductor Packages with Integrated Heat Spreaders

Semiconductor Package with Improved Testability

Semiconductor Package Having an Interposer Configured for Magnetic...

Semiconductor Interposer Having a Cavity for Intra-Interposer Die

Semiconductor Package with Ultra-Thin Interposer Without Through-Se...

Semiconductor Package with a Bridge Interposer

Programmable Interposer with Conductive Particles

Stacked Packaging Using Reconstituted Wafers

Wafer Level Semiconductor Package

Multi-Chip and Multi-Substrate Reconstitution Based Packaging

Thermal Enhanced Package Using Embedded Substrate

Gas burner with thermoelectric generator

Gas stove with thermoelectric generator

Semiconductor device module with flip chip devices on a common lead...