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Kevin Kuo

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  • Taipei Hsien, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    COOLING MODULE AGAINST ESD AND ELECTRONIC PACKAGE, ASSEMBLY AND SYS...
    • Publication number 20080012123
    • Publication date Jan 17, 2008
    • VIA TECHNOLOGIES, INC.
    • Kevin Kuo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Electronic device
    • Publication number 20060056149
    • Publication date Mar 16, 2006
    • Via Technologies, Inc.
    • Robert Kuo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Main board and fixing component thereof
    • Publication number 20060040529
    • Publication date Feb 23, 2006
    • VIA TECHNOLOGIES, INC.
    • Kevin Kuo
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Expandable heat sink
    • Publication number 20060023423
    • Publication date Feb 2, 2006
    • VIA TECHNOLOGIES, INC.
    • Kevin Kuo
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Connection device with plurality return paths
    • Publication number 20060024991
    • Publication date Feb 2, 2006
    • VIA TECHNOLOGIES, INC.
    • Kevin Kuo
    • H01 - BASIC ELECTRIC ELEMENTS