Kevin Lee

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Hsin-Chu City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Package of a semiconductor device with a flexible wiring substrate...
- Patent number 7,663,234
- Issue date Feb 16, 2010
- United Microelectronics Corp.
- Joseph Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package of a semiconductor device with a flexible wiring substrate...
- Patent number 7,303,400
- Issue date Dec 4, 2007
- United Microelectronics Corp.
- Joseph Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20230260836
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei Shan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE OF A SEMICONDUCTOR DEVICE WITH A FLEXIBLE WIRING SUBSTRATE...
- Publication number 20060202333
- Publication date Sep 14, 2006
- UNITED MICROELECTRONICS CORP.
- Joseph Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package of a semiconductor device with a flexible wiring substrate...
- Publication number 20050161756
- Publication date Jul 28, 2005
- UNITED MICROELECTRONICS CORP.
- Joseph Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR