Kevin R. Lish

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Higley, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device packaging
- Patent number 7,425,464
- Issue date Sep 16, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die encapsulation using a porous carrier
- Patent number 7,015,075
- Issue date Mar 21, 2006
- Freescale Semiconuctor, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING A MICROELECTRONIC ASSEMBLY INCLUDING ENCAPSULATI...
- Publication number 20080182363
- Publication date Jul 31, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Craig S. Amrine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device packaging
- Publication number 20070210461
- Publication date Sep 13, 2007
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die encapsulation using a porous carrier
- Publication number 20050176180
- Publication date Aug 11, 2005
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS