Kevin Song

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Face-up wafer electrochemical planarization apparatus
- Patent number 12,090,600
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate polish edge uniformity control with secondary fluid dispense
- Patent number 11,724,355
- Issue date Aug 15, 2023
- Applied Materials, Inc.
- Justin H. Wong
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and systems for centrifugal casting of polymer polish pads...
- Patent number 11,090,778
- Issue date Aug 17, 2021
- Thomas West, Inc.
- Thomas West
- B24 - GRINDING POLISHING
Information Patent Grant
Multilayer polishing pads made by the methods for centrifugal casti...
- Patent number 10,722,997
- Issue date Jul 28, 2020
- Thomas West, Inc.
- Thomas West
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Low cost and low dishing slurry for polysilicon CMP
- Patent number 7,199,056
- Issue date Apr 3, 2007
- Applied Materials, Inc.
- Sen-Hou Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for process monitoring
- Patent number 6,936,842
- Issue date Aug 30, 2005
- Applied Materials, Inc.
- Suraj Rengarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process conditions and precursors for atomic layer deposition (ALD)...
- Patent number 6,620,670
- Issue date Sep 16, 2003
- Applied Materials, Inc.
- Kevin Song
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
- Publication number 20250001547
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Application
FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
- Publication number 20230390887
- Publication date Dec 7, 2023
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISH EDGE UNIFORMITY CONTROL WITH SECONDARY FLUID DISPENSE
- Publication number 20230339066
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Justin H. WONG
- B24 - GRINDING POLISHING
Information Patent Application
FACE-UP WAFER EDGE POLISHING APPARATUS
- Publication number 20230024009
- Publication date Jan 26, 2023
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISH EDGE UNIFORMITY CONTROL WITH SECONDARY FLUID DISPENSE
- Publication number 20220097198
- Publication date Mar 31, 2022
- Applied Materials, Inc.
- Justin H. WONG
- B24 - GRINDING POLISHING
Information Patent Application
Controlling Chemical Mechanical Polishing Pad Stiffness By Adjustin...
- Publication number 20200276685
- Publication date Sep 3, 2020
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Application
Multilayer Polishing Pads Made by the Methods for Centrifugal Casti...
- Publication number 20140287663
- Publication date Sep 25, 2014
- Thomas West
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Methods and Systems for Centrifugal Casting of Polymer Polish Pads...
- Publication number 20130260657
- Publication date Oct 3, 2013
- Thomas West
- B24 - GRINDING POLISHING
Information Patent Application
LOW COST AND LOW DISHING SLURRY FOR POLYSILICON CMP
- Publication number 20070082833
- Publication date Apr 12, 2007
- Sen-Hou Ko
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Low cost and low dishing slurry for polysilicon CMP
- Publication number 20030153189
- Publication date Aug 14, 2003
- APPLIED MATERIALS, INC.
- Sen-Hou Ko
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROCESS CONDITIONS AND PRECURSORS FOR ATOMIC LAYER DEPOSITION (ALD)...
- Publication number 20030139005
- Publication date Jul 24, 2003
- Applied Materials, Inc.
- Kevin Song
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for process monitoring
- Publication number 20030032207
- Publication date Feb 13, 2003
- Suraj Rengarajan
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Face-up wafer electrochemical planarization apparatus

Substrate polish edge uniformity control with secondary fluid dispense

Methods and systems for centrifugal casting of polymer polish pads...

Multilayer polishing pads made by the methods for centrifugal casti...

Low cost and low dishing slurry for polysilicon CMP

Method and apparatus for process monitoring

Process conditions and precursors for atomic layer deposition (ALD)...

Patents Applicationslast 30 patents

FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS

FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS

SUBSTRATE POLISH EDGE UNIFORMITY CONTROL WITH SECONDARY FLUID DISPENSE

FACE-UP WAFER EDGE POLISHING APPARATUS

SUBSTRATE POLISH EDGE UNIFORMITY CONTROL WITH SECONDARY FLUID DISPENSE

Controlling Chemical Mechanical Polishing Pad Stiffness By Adjustin...

Multilayer Polishing Pads Made by the Methods for Centrifugal Casti...

Methods and Systems for Centrifugal Casting of Polymer Polish Pads...

LOW COST AND LOW DISHING SLURRY FOR POLYSILICON CMP

Low cost and low dishing slurry for polysilicon CMP

PROCESS CONDITIONS AND PRECURSORS FOR ATOMIC LAYER DEPOSITION (ALD)...

Method and apparatus for process monitoring