Kevin W. Hutto

Person

Kuna, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for forming backside illuminated image sensors with front s...
- Patent number 9,666,638
- Issue date May 30, 2017
- Semiconductor Components Industries, LLC
- Swarnal Borthakur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming backside illuminated image sensors with front s...
- Patent number 9,362,330
- Issue date Jun 7, 2016
- Semiconductor Components Industries, LLC
- Swarnal Borthakur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic workpieces and methods for manufacturing microelect...
- Patent number 8,987,874
- Issue date Mar 24, 2015
- Micron Technology, Inc.
- Kevin W. Hutto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid sample analysis systems
- Patent number 8,794,050
- Issue date Aug 5, 2014
- Nanoscopia (Cayman), Inc.
- Kevin W. Hutto
- G01 - MEASURING TESTING
Information Patent Grant
Methods for forming backside illuminated image sensors with front s...
- Patent number 8,697,473
- Issue date Apr 15, 2014
- Aptina Imaging Corporation
- Swarnal Borthakur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for exposing semiconductor workpieces to vapors...
- Patent number 8,568,535
- Issue date Oct 29, 2013
- Micron Technology, Inc.
- Kevin W. Hutto
- B08 - CLEANING
Information Patent Grant
Microelectronic workpieces with stand-off projections and methods f...
- Patent number 8,492,198
- Issue date Jul 23, 2013
- Micron Technology, Inc.
- Kevin W. Hutto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated bond pad with conductive via interconnect
- Patent number 8,314,498
- Issue date Nov 20, 2012
- Aptina Imaging Corporation
- Kevin Hutto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for exposing semiconductor workpieces to vapors...
- Patent number 8,221,557
- Issue date Jul 17, 2012
- Micron Technology, Inc.
- Kevin W. Hutto
- B08 - CLEANING
Information Patent Grant
Microelectronic workpieces and methods for manufacturing microelect...
- Patent number 7,928,582
- Issue date Apr 19, 2011
- Micron Technology, Inc.
- Kevin W. Hutto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for selectively filling apertures in a substrate to form co...
- Patent number 7,560,371
- Issue date Jul 14, 2009
- Micron Technology, Inc.
- Ross S. Dando
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR FORMING BACKSIDE ILLUMINATED IMAGE SENSORS WITH FRONT S...
- Publication number 20160233267
- Publication date Aug 11, 2016
- Semiconductor Components Industries, LLC
- Swarnal BORTHAKUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING BACKSIDE ILLUMINATED IMAGE SENSORS WITH FRONT S...
- Publication number 20140197511
- Publication date Jul 17, 2014
- Aptina Imaging Corporation
- Swarnal Borthakur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC WORKPIECES AND METHODS FOR MANUFACTURING MICROELECT...
- Publication number 20130302941
- Publication date Nov 14, 2013
- Micron Technology, Inc.
- Kevin W. Hutto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR EXPOSING SEMICONDUCTOR WORKPIECES TO VAPORS...
- Publication number 20120270405
- Publication date Oct 25, 2012
- Micron Technology, Inc.
- Kevin W. Hutto
- B08 - CLEANING
Information Patent Application
METHODS FOR FORMING BACKSIDE ILLUMINATED IMAGE SENSORS WITH FRONT S...
- Publication number 20120193741
- Publication date Aug 2, 2012
- Swarnal Borthakur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID SAMPLE ANALYSIS SYSTEMS
- Publication number 20120194669
- Publication date Aug 2, 2012
- Kevin W. Hutto
- G01 - MEASURING TESTING
Information Patent Application
ISOLATED BOND PAD WITH CONDUCTIVE VIA INTERCONNECT
- Publication number 20120061786
- Publication date Mar 15, 2012
- Kevin Hutto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC WORKPIECES AND METHOD FOR MANUFACTURING MICROELECTR...
- Publication number 20110212614
- Publication date Sep 1, 2011
- Micron Technology, Inc.
- Kevin W. Hutto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR EXPOSING SEMICONDUCTOR WORKPIECES TO VAPORS...
- Publication number 20090007934
- Publication date Jan 8, 2009
- Micron Technology, Inc.
- Kevin W. Hutto
- B08 - CLEANING
Information Patent Application
MICROELECTRONIC WORKPIECES AND METHODS FOR MANUFACTURING MICROELECT...
- Publication number 20080217763
- Publication date Sep 11, 2008
- Micron Technology, Inc.
- Kevin W. Hutto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and systems for selectively filling apertures in a substrat...
- Publication number 20080057691
- Publication date Mar 6, 2008
- Ross S. Dando
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kevin W. Hutto

Person

Patents Grantslast 30 patents

Methods for forming backside illuminated image sensors with front s...

Methods for forming backside illuminated image sensors with front s...

Microelectronic workpieces and methods for manufacturing microelect...

Fluid sample analysis systems

Methods for forming backside illuminated image sensors with front s...

Systems and methods for exposing semiconductor workpieces to vapors...

Microelectronic workpieces with stand-off projections and methods f...

Isolated bond pad with conductive via interconnect

Systems and methods for exposing semiconductor workpieces to vapors...

Microelectronic workpieces and methods for manufacturing microelect...

Methods for selectively filling apertures in a substrate to form co...

Patents Applicationslast 30 patents

METHODS FOR FORMING BACKSIDE ILLUMINATED IMAGE SENSORS WITH FRONT S...

METHODS FOR FORMING BACKSIDE ILLUMINATED IMAGE SENSORS WITH FRONT S...

MICROELECTRONIC WORKPIECES AND METHODS FOR MANUFACTURING MICROELECT...

SYSTEMS AND METHODS FOR EXPOSING SEMICONDUCTOR WORKPIECES TO VAPORS...

METHODS FOR FORMING BACKSIDE ILLUMINATED IMAGE SENSORS WITH FRONT S...

FLUID SAMPLE ANALYSIS SYSTEMS

ISOLATED BOND PAD WITH CONDUCTIVE VIA INTERCONNECT

MICROELECTRONIC WORKPIECES AND METHOD FOR MANUFACTURING MICROELECTR...

SYSTEMS AND METHODS FOR EXPOSING SEMICONDUCTOR WORKPIECES TO VAPORS...

MICROELECTRONIC WORKPIECES AND METHODS FOR MANUFACTURING MICROELECT...

Methods and systems for selectively filling apertures in a substrat...