Kevin Yu Chen

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Solvent assisted burnishing of pre-underfilled solder bumped wafers...
- Patent number 7,170,185
- Issue date Jan 30, 2007
- 3M Innovative Properties Company
- Peter B. Hogerton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density electronic package
- Patent number 6,246,010
- Issue date Jun 12, 2001
- 3M Innovative Properties Company
- Robert L. D. Zenner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers...
- Publication number 20070102827
- Publication date May 10, 2007
- 3M Innovative Properties Company
- Peter B. Hogerton
- H01 - BASIC ELECTRIC ELEMENTS